Polyphenylene Ether Resin Composition for High-Frequency Circuit Substrates
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Solution Overview
Problem
Existing polyphenylene ether resin compositions for high-frequency circuit substrates face challenges in achieving a balance of low dielectric constant, low dielectric loss, high heat resistance, and sufficient interlayer adhesive force while avoiding issues like volatilization during processing and poor bending strength.
Innovation Solution
A polyphenylene ether resin composition incorporating a vinyl-modified polyphenylene ether resin and an organosilicon resin with a three-dimensional network structure, using TT or TQ organosilicon resin as a crosslinking agent, which provides high crosslinking density, heat resistance, and improved mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cyclic organosilicon compound containing unsaturated double bonds is used as crosslinking agent, then overall properties are improved, but volatilization occurs during sizing and baking process
Solution Approach 1:
The invention changes the molecular weight parameter of the organosilicon compound from small (cyclic) to large (polymer), which eliminates volatilization during processing while maintaining the crosslinking functionality and overall performance benefits
2Adaptability or versatility
If linear organosilicon compound containing unsaturated double bonds is used as crosslinking agent, then flexibility is improved, but bending strength decreases
Solution Approach 1:
The invention creates a composite structure by combining the flexible linear organosilicon backbone with a three-dimensional crosslinked network formed through unsaturated double bonds, achieving both flexibility and high bending strength simultaneously
3Temperature
If polyphenylene ether resin is used, then heat resistance and dimensional stability are improved, but processability worsens due to high melting point
Solution Approach 1:
The invention changes the chemical structure parameter by introducing vinyl groups at chain ends and using organosilicon crosslinking agents, transforming the material from thermoplastic to thermosetting, which improves processability while maintaining heat resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high glass transition temperature, low water absorption, low dielectric constant, low dielectric loss, and high bending strength, enhancing the reliability and performance of high-frequency circuit substrates while preventing volatilization during processing.
Implementation Method 1
An organosilicon compound containing unsaturated double bonds is used as a crosslinking agent for vinyl active group-modified thermosetting polyphenylene ether
Implementation Method 2
TT organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and formed by hydrolytic condensation of trifunctional siloxane unit (T unit)
Data Source
AI summary
The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has a high glass-transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate of high-speed electronic equipment.