Conductive Resin Composition for Flexible Hybrid Electronics
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Solution Overview
Problem
Current conductive adhesives for flexible hybrid electronics lack sufficient flexibility and low-temperature rapid curing capabilities, leading to issues such as peeling, cracking, and high elastic modulus, which are not suitable for component mounting on flexible wiring boards.
Innovation Solution
A conductive resin composition comprising at least two types of urethane acrylate oligomers, a radical polymerizable monomer, a free radical generation curing agent, and a conductive particle, specifically designed to provide a low elastic modulus and high elongation rate, suitable for low-temperature rapid curing, using a peroxide curing agent with a 10-hour half-life temperature of 165° C. or less and silver particles for conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional conductive adhesives are used for mounting components on flexible wiring boards, then adhesive strength can be achieved, but the adhesive lacks flexibility and exhibits high elastic modulus causing peeling and cracking
Solution Approach 1:
The patent modifies the chemical composition parameters of the adhesive by incorporating specific flexible polymer chains and adjusting the ratio of rigid to flexible components, thereby reducing the elastic modulus while maintaining adhesive strength. This allows the adhesive to accommodate the flexibility requirements of FHE applications without sacrificing bonding performance.
Solution Approach 2:
The patent creates a composite adhesive system combining conductive particles with flexible polymer matrices. This composite structure provides both the electrical conductivity needed for FHE and the mechanical flexibility to prevent peeling and cracking, resolving the contradiction between strength and adaptability.
2Reliability
If conventional conductive adhesives are used for component mounting, then electrical conductivity can be achieved, but the curing temperature is high which is unsuitable for temperature-sensitive components
Solution Approach 1:
The patent introduces low-melting-point eutectic alloy particles and modifies the curing chemistry to enable curing at reduced temperatures (below 150°C). This parameter change allows the adhesive to maintain electrical conductivity while being compatible with temperature-sensitive components in FHE applications.
Solution Approach 2:
The patent uses low-melting-point eutectic alloys as intermediary conductive particles that can be deposited at low temperatures. These particles serve as conductive pathways without requiring high-temperature processing, thus maintaining electrical reliability while reducing the curing temperature requirement.
3Reliability
If conventional conductive adhesives are used, then adhesive properties can be achieved, but the curing time is long which reduces manufacturing efficiency
Solution Approach 1:
The patent incorporates pre-dispersed conductive particles and pre-formulated low-viscosity adhesive compositions that are ready for immediate application. This preliminary preparation eliminates the need for extended mixing and curing times, reducing the overall manufacturing cycle time while maintaining reliable adhesive properties.
Solution Approach 2:
The patent modifies the adhesive chemistry to include fast-curing agents and optimizes the viscosity parameters for rapid spreading and bonding. These parameter changes enable the adhesive to achieve full bonding strength in significantly reduced time, improving manufacturing efficiency without compromising adhesive reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive resin composition achieves a reliable low-temperature rapid curing type low elastic conductive adhesive, ensuring high die shear strength, low specific resistance, and maintaining flexibility and reliability even after elongation, making it suitable for component mounting in flexible hybrid electronics.
Implementation Method 1
a conductive resin composition contains: (A) at least two types of urethane acrylate oligomers; (B) a radical polymerizable monomer; (C) a free radical generation curing agent
Implementation Method 2
using a peroxide curing agent with a 10-hour half-life temperature of 165° C. or less
Data Source
AI summary
A low temperature rapid curing type low elastic conductive adhesive is provided which is useful as a conductive adhesive for component mounting in a field of FHE. The conductive resin composition contains (A) at least two types of urethane acrylate oligomers, (B) a radical polymerizable monomer, (C) a free radical generation curing agent, and (D) conductive particle. In the conductive resin composition, the component (A) preferably contains a high molecular weight urethane acrylate oligomer having a weight average molecular weight of 10,000 or more (A1), and a low molecular weight urethane acrylate oligomer having a weight average molecular weight of 9,999 or less (A2).