Low-Resistance Conductive Tape with Nickel-Plated Copper

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Solution Overview

Problem

Conventional conductive tapes used in IT devices suffer from galvanic corrosion and oxidation due to metal exposure to moisture, leading to reduced performance and increased resistance, primarily because they contain acid components in the adhesive.

Innovation Solution

A low-resistance conductive tape is developed with a conductive fiber layer, a nickel-plated copper metal layer, and an acrylic adhesive without acid components, along with a urethane coating layer containing indium tin oxide to enhance waterproofness and prevent surface contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional conductive adhesive containing acid component is used, then conductivity is achieved, but oxidation and corrosion occur

Engineering Contradiction:

Improvecorrosion resistanceVSAvoidoxidation

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The harmful acid component is extracted and removed from the adhesive system. The patent uses acrylic adhesive that specifically excludes acid components, thereby eliminating the source of oxidation while maintaining adhesive functionality and conductivity.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs a composite structure combining nickel-plated copper metal layer with acrylic adhesive. This composite material system provides both conductivity and corrosion resistance, where the nickel plating protects the copper from oxidation and the acrylic adhesive provides bonding without acid-induced corrosion.

Inventive Principle:

Principle #40Composite materials

2Reliability

If metal layer is exposed to moisture, then conductivity is maintained, but galvanic corrosion occurs

Engineering Contradiction:

Improveconductivity stabilityVSAvoidmoisture exposure

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The nickel plating layer acts as a protective thin film shell over the copper metal layer. This flexible protective layer prevents moisture penetration while maintaining the electrical conductivity of the underlying copper, thereby preventing galvanic corrosion.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The nickel layer serves as an intermediary protective barrier between the copper metal and the corrosive environment. It mediates the interaction by providing a corrosion-resistant interface that prevents direct contact between moisture and the copper surface.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If conductive metal powder is added to adhesive, then conductivity is improved, but surface contamination increases

Engineering Contradiction:

Improveelectrical conductivityVSAvoidsurface contamination

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The urethane coating layer forms a protective shell over the conductive adhesive surface. This thin film encapsulates the conductive metal powder, preventing surface contamination while preserving the electrical conductivity pathway through the adhesive layer.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents galvanic corrosion and oxidation, maintains RF performance, and exhibits excellent salt-water and high-temperature resistance, while reducing the risk of adhesive contamination and maintaining electrical conductivity.

Implementation Method 1

Since the metal layer including copper plated with nickel is formed, an excellent effect of preventing galvanic corrosion and an excellent moisture-blocking effect are exhibited

Methodology Applied

Scientific EffectGalvanic corrosion prevention:

Implementation Method 2

the acrylic adhesive containing no acid component is used, thus securing an excellent effect of preventing oxidation

Methodology Applied

Scientific EffectOxidation prevention: Oxidation

Implementation Method 3

the acrylic adhesive containing no acid component is used, thus securing an excellent effect of preventing oxidation

Methodology Applied

Scientific EffectOxidation prevention: Oxidation

Implementation Method 4

The urethane coating layer is formed, thus suppressing surface contamination of the conductive tape caused by a conductive adhesive and further enhancing waterproofness

Methodology Applied

Scientific EffectWaterproofing:

Data Source

PatentUS10343375B2Low-resistance conductive tape enhancing and maintaining RF performance and having excellent effect of preventing galvanic corrosion and oxidation

Publication Date: 2019.07.09 ICH

AI summary

Disclosed is a low-resistance conductive tape enhancing and maintaining RF performance and having an excellent effect of preventing galvanic corrosion and oxidation. More particularly, the low-resistance conductive tape includes a conductive fiber layer including conductive fibers, a conductive adhesive layer formed on an upper side and a lower side of the conductive fiber layer, and a metal layer which is formed on one side of the conductive fiber layer having the conductive adhesive layer formed thereon and which includes copper plated with nickel. In the low-resistance conductive tape, since the metal layer including copper plated with nickel is formed, an excellent effect of preventing galvanic corrosion and an excellent moisture-blocking effect are exhibited, and an acrylic adhesive containing no acid component is used, thus securing an excellent effect of preventing oxidation.