CMP AE Sensor Isolation for Precise Polishing End-Point Detection

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Solution Overview

Problem

Existing semiconductor manufacturing devices face challenges in accurately determining the polishing end point during chemical mechanical polishing (CMP) processes, leading to potential errors due to noise interference from conductive components affecting the acoustic emission (AE) sensor's signal-to-noise ratio.

Innovation Solution

The device incorporates insulating first and second members to isolate the AE sensor from conductive components, using fastening members with insulating materials and anti-vibration mechanisms to minimize noise interference, allowing precise detection of the polishing end point by accurately transmitting vibration signals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the AE sensor is positioned close to the polishing pad for accurate detection, then measurement precision improves, but noise interference from conductive components increases

Engineering Contradiction:

Improvepolishing end point detection accuracyVSAvoidnoise interference from conductive components

Core Design Contradiction:

Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

An insulating member is introduced as an intermediary between the AE sensor and the conductive turntable structure. This insulating member allows the AE sensor to maintain close proximity to the polishing pad for accurate vibration detection while simultaneously blocking electrical noise from the conductive components, thus resolving the contradiction between measurement precision and noise interference.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If conductive components are used for structural support and electrical grounding, then device reliability improves, but acoustic emission sensor signal-to-noise ratio deteriorates

Engineering Contradiction:

Improvestructural support and grounding stabilityVSAvoidAE sensor signal-to-noise ratio

Core Design Contradiction:

ReliabilityVSMeasurement precision

Solution Approach 1:

The support structure is segmented into conductive portions (for structural support and grounding) and insulating portions (for noise isolation). The insulating member is specifically positioned between the AE sensor and the conductive turntable, allowing the system to maintain both structural reliability through conductive components and signal quality through insulating barriers.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The insulating member serves as a mediator that allows the coexistence of conductive and insulating components in the support structure. It enables the AE sensor to be supported by the conductive turntable structure while being electrically isolated from it, thus maintaining both structural reliability and measurement precision.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Measurement precision

If vibration isolation mechanisms are added to reduce noise, then measurement precision improves, but device complexity increases

Engineering Contradiction:

Improvevibration signal accuracyVSAvoidnumber of isolation components

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The insulating member serves a dual function as both an electrical insulator and a vibration isolation element. By selecting materials with appropriate damping properties, the insulating member provides vibration isolation without requiring additional dedicated isolation components, thus improving measurement precision while minimizing increases in device complexity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables accurate determination of the polishing end point, enhancing the precision of CMP processes by reducing noise interference and improving signal transmission, thereby ensuring consistent film removal quality.

Implementation Method 1

a first AE sensor to come into contact with the second member

Methodology Applied

Scientific EffectAcoustic emission: Acoustic Emission

Implementation Method 2

The device incorporates insulating first and second members to isolate the AE sensor from conductive components

Methodology Applied

Scientific EffectElectrical insulation: Electrical Resistance

Implementation Method 3

using fastening members with insulating materials and anti-vibration mechanisms to minimize noise interference

Methodology Applied

Scientific EffectVibration damping: Damping

Data Source

PatentUS12459075B2Semiconductor manufacturing device

Publication Date: 2025.11.04 KIOXIA CORP

AI summary

A semiconductor manufacturing device includes: a turntable configured to be rotatable and having a first surface; a polishing pad provided on the first surface; a first support portion configured to rotatably hold the turntable; a top ring having a second surface and including a suction mechanism that holds an object to be processed on the second surface; a second support portion configured to rotatably hold the top ring; a first member to come into contact with the turntable or top ring; a second member to come into contact with the polishing pad or suction mechanism and with the turntable or top ring via the first member; and a first acoustic emission sensor to come into contact with the second member.