Lapping Machines TRIZ Cases
- Turn table transport carriage
See how an inclination mechanism enables turn table transport through narrow passages by tiltin
- Modular CMP Polishing Layout for Higher Throughput Density
A one-to-one CMP module layout enables parallel loading, unloading, and polishing to remove substrate handling bottlenecks and raise throughput density.
- CMP Cleaning Brush with Tilted Outlet Channels for Uniform Flow
Tilted outlet channels and zoned core geometry improve post-CMP fluid distribution, cutting cleaning time and contamination defects.
- CMP Substrate Orientation Sensing for Precise Endpoint Analysis
An in-platen orientation sensor scans the substrate edge to locate a reference mark and align endpoint readings with wafer rotation.
- Guanidinium Polyionic CMP Slurries for Low-Dishing Tungsten Planarization
Guanidinium-based polymer additives help tungsten CMP slurries cut dishing and erosion while maintaining polishing rates and wafer planarity.
- Polishing Pad Holder Flow Design to Prevent Substrate Surface Damage
Fresh polishing liquid is fed by nozzle and center discharge passages to avoid rotary-joint particles, protect the substrate surface, and sustain polishing rate.
- Substrate Pusher Magnetic Seating Detection Against Slurry Interference
Magnetic seating sensing replaces optical detection in substrate pushers to avoid slurry and cleaning water interference and improve handling accuracy.
- Substrate Transfer Control for Sensor Failure Override
When substrate position sensors fail, controller-accepted external input keeps transfer and processing running to prevent deterioration and downtime.
- Carrier Plate Double-Sided Polishing With Embedded Abrasive Pads
Embedded abrasive grains in double-sided polishing pads raise carrier plate removal rate while maintaining flatness for wafer polishing.
- CMP Profile Control Using Eddy Current Endpoint Detection
In-situ eddy current feedback detects underlying layer exposure during CMP and switches control logic to improve within-wafer thickness uniformity.
- Polishing Pad Thermal Conduction Structure for CMP Temperature Control
A conductive body embedded in the polishing pad improves thermal coupling to the platen, enabling faster CMP pad temperature control.
- RBSC CMP Pad Conditioner With Protruding Diamonds
Embedded diamond particles in an RBSC CMP pad conditioner resist corrosion-driven loss while maintaining flat, stable wafer conditioning.
- CMP Platen Edge-Shape Control With Annular Pressure Chambers
Annular pressure chambers flex the CMP platen edge to correct wafer thickness non-uniformity and stabilize polishing rates.
- Wafer Planarization Control Using Multi-Point Thickness Mapping
Multi-point thickness measurement guides region-specific wafer planarization, reducing step height while improving processing speed and surface uniformity.
- CMP Polishing Pad Caterpillar Cooling for Temperature Control
A caterpillar module linked to rotating bodies and a temperature controller stabilizes CMP polishing temperature while limiting pad contamination.
- CMP End-Point Detection With Insulated AE Sensor Mounting
Insulated sensor mounting blocks conductive noise and vibration, improving AE-based CMP end-point detection accuracy.
- Substrate Polishing Layout With Integrated Buffer Coating Modules
Integrated buffer and coating modules between polishing and cleaning stages improve space use, transfer flow, and contamination control.