CMP Polishing Pad Caterpillar Cooling for Temperature Control
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Solution Overview
Problem
Chemical mechanical polishing processes in semiconductor manufacturing face challenges in effectively controlling polishing temperature, which affects the process's characteristics and reliability.
Innovation Solution
A substrate processing device with a caterpillar module thermally connected to a temperature controller, utilizing rotating bodies and heat transfer modules to control polishing temperature and maintain cleanliness, comprising a platen, polishing pad, and rotating bodies engaged with a caterpillar module for temperature regulation and contaminant removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polishing temperature control methods are used, then the polishing process can be maintained, but the polishing temperature cannot be effectively controlled, affecting process reliability
Solution Approach 1:
A caterpillar module is introduced as an intermediary thermal management component between the heat source (polishing interface) and the cooling system. The caterpillar module includes a caterpillar body with multiple segments that contact the polishing pad, enabling efficient heat transfer from the polishing interface to the cooling fluid circulating through the rotating bodies, thereby achieving effective polishing temperature control and improving process reliability
Solution Approach 2:
The invention utilizes hydraulic cooling by circulating cooling fluid through channels in the first and second rotating bodies. The rotating bodies act as heat exchangers, transferring heat from the caterpillar module to the cooling fluid, which is pumped through the system to maintain controlled polishing temperatures, thus resolving the temperature control issue and enhancing process reliability
2Temperature
If the caterpillar module is disposed on the polishing pad, then temperature control is improved, but contamination may occur on the polishing pad surface
Solution Approach 1:
The caterpillar module is designed to extend outside the outer circumferential surface of the polishing pad, extracting the thermal management function from the polishing pad surface. This separation allows the caterpillar module to perform temperature control without generating contamination on the polishing pad, as the cooling fluid circulation and heat exchange occur in the rotating bodies external to the pad surface
Solution Approach 2:
The caterpillar module is divided into multiple segments (caterpillar body with multiple segments) that can contact the polishing pad for heat transfer while the main body extends outside the polishing pad circumference. This segmentation allows the contaminated-contacting portions to be separated from the clean polishing pad surface, preventing contamination while maintaining effective thermal contact where needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device efficiently controls polishing temperature and minimizes contamination, enhancing the reliability and effectiveness of the chemical mechanical polishing process.
Implementation Method 1
a temperature controller thermally connected to the caterpillar module
Implementation Method 2
rotating first rotating body and the second rotating body to rotate the caterpillar module
Data Source
AI summary
A substrate processing device includes a platen, a polishing pad disposed on the platen, a first rotating body, a second rotating body spaced apart from the first rotating body, a caterpillar module disposed on a portion of the polishing pad and engaged with the first rotating body and the second rotating body, and a temperature controller thermally connected to the caterpillar module.