Eccentric Roller Wafer Holding for Full-Surface Processing
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Solution Overview
Problem
Existing substrate processing technologies face inefficiencies in cleaning and processing the entire surface of substrates, such as wafers, due to issues like foreign matter adherence, which can cause short-circuits and patterning deviations, and there is a need for improved apparatuses to enhance processing efficiency.
Innovation Solution
A substrate holding apparatus with rollers and eccentric shafts that rotate the substrate in a circular motion while simultaneously rotating about its axis, increasing the relative speed between a processing head and the substrate surface for enhanced processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a substrate is rotated only about its axis using conventional chuck mechanisms, then the substrate can be processed, but the processing efficiency is insufficient and the entire substrate surface cannot be processed effectively
Solution Approach 1:
The substrate rotation mechanism is transformed from a static single-axis rotation to a dynamic dual-motion system. The substrate performs both axial rotation (spinning) and circular orbital motion simultaneously, creating a complex dynamic trajectory that enhances processing efficiency by exposing different areas of the substrate surface to the processing head at varying speeds and positions.
Solution Approach 2:
The rotation mechanism adds a second dimension of motion by implementing circular orbital movement in addition to the primary axial rotation. This dimensional enhancement allows the substrate to traverse a larger area and enables the processing head to access the entire substrate surface more effectively, resolving the limitation of conventional single-axis rotation.
2Productivity
If the substrate is processed with conventional rotation speed, then the processing can be completed, but the relative speed between processing head and substrate surface is insufficient for enhanced efficiency
Solution Approach 1:
The system dynamically adjusts the substrate motion by combining axial rotation with circular orbital movement. This dynamic dual-motion approach creates variable relative speeds between the processing head and different areas of the substrate surface, enhancing processing rate by ensuring high-speed contact across the entire substrate area rather than maintaining a constant, limited rotation speed.
3Reliability
If foreign matter remains on the substrate surface, then the substrate can be handled, but short-circuits and patterning deviations occur reducing reliability
Solution Approach 1:
The enhanced dynamic rotation mechanism with dual motion (axial rotation plus circular orbital movement) improves reliability by enabling more effective cleaning processes. The varied motion轨迹 allows cleaning tools to access and remove foreign matter from all areas of the substrate surface more thoroughly than conventional single-axis rotation, preventing short-circuits and patterning deviations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combination of circular and axial rotation of the substrate increases processing speed and efficiency by enhancing the relative speed between the processing head and the substrate surface, thereby improving the processing rate.
Implementation Method 1
eccentric shafts coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions and second shaft portions, the second shaft portions being eccentric relative to the first shaft portions
Data Source
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AI summary
A substrate holding apparatus which can enhance the efficiency of processing of a substrate, such as a wafer (W), is disclosed. The substrate holding apparatus for holding a substrate and rotating the substrate, includes: rollers (11a, 11b) capable of contacting a periphery of the substrate; a roller rotating mechanism (12) configured to rotate the rollers; and eccentric shafts (13a, 13b) coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions (14a, 15b) and second shaft portions (15a, 15b), the second shaft portions being eccentric relative to the first shaft portions, the first shaft portions being secured to the roller rotating mechanism, and the rollers being secured to the second shaft portions, respectively.