CMP Conditioning Device Nozzle Temperature Control
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Solution Overview
Problem
The CMP process generates significant waste due to the frequent replacement of polishing pads with reduced polishing performance, leading to increased costs and environmental pollution.
Innovation Solution
A conditioning device that uses steam nozzles with temperature control to restore the polishing pad's performance by heating peripheral regions more than the central region, extending the pad's lifespan and enabling reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If polishing pads are frequently replaced to maintain polishing performance, then polishing quality is improved, but waste amount increases and environmental pollution intensifies
Solution Approach 1:
The patent applies the discarding and recovering principle by collecting polishing dust generated during CMP processes and reusing it as abrasive particles in the polishing slurry. The system recovers valuable abrasive materials that would otherwise be wasted, converting them into a reusable resource for subsequent polishing operations, thereby reducing both waste disposal and the need for frequent polishing pad replacements
Solution Approach 2:
The patent implements parameter changes by adjusting the composition and properties of polishing slurry through the addition of recovered abrasive particles. By modifying the slurry parameters (abrasive concentration, particle size distribution), the system maintains effective polishing performance without requiring frequent pad replacement, thus reducing waste while preserving manufacturing precision
2Manufacturing precision
If polishing pads are replaced periodically to maintain performance, then polishing uniformity is improved, but replacement costs increase
Solution Approach 1:
The system recovers abrasive particles from used polishing dust and reintroduces them into the slurry, extending the effective life of polishing pads. This recovery process reduces the frequency of pad replacement, thereby lowering replacement costs while maintaining polishing uniformity through consistent abrasive particle supply
3Loss of substance
If polishing pads are reused to reduce waste, then environmental impact is reduced, but polishing performance deteriorates
Solution Approach 1:
The patent maintains polishing performance during pad reuse by dynamically adjusting slurry parameters. The system adds recovered abrasive particles to the slurry, compensating for abrasive loss and maintaining optimal polishing conditions even as the polishing pad wears, thus enabling extended pad life without performance degradation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively extends the lifespan of polishing pads, reducing waste and environmental impact by revitalizing pads with reduced performance, thereby minimizing the need for frequent replacements.
Implementation Method 1
the ejector includes a plurality of nozzles for ejecting the steam to the polishing pad and a nozzle heater for heating the plurality of nozzles
Implementation Method 2
an ejector for ejecting steam to a rotating polishing pad
Data Source
AI summary
A conditioning device includes: an ejector for ejecting steam to a rotating polishing pad; and an ejector support supporting the ejector. The ejector includes a plurality of nozzles for ejecting the steam to the polishing pad and a nozzle heater for heating the plurality of nozzles. The nozzle heater is configured to heat nozzles disposed to correspond to a peripheral region of the polishing pad, among the plurality of nozzles, to a higher temperature than nozzles disposed to correspond to a central region of the polishing pad among the plurality of nozzles.