Mechanical Stopper for Head Height Adjustment

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in accurately adjusting the height of the processing head with respect to the substrate, particularly when replacing polishing pads, which affects the contact situation and polishing performance.

Innovation Solution

A substrate processing apparatus equipped with a mechanical stopper device that includes a first member with a predetermined inclined surface and a second member with a sliding inclined surface, allowing for precise adjustment of the stop position of the processing head using a ball screw and motor, and utilizing an air cylinder for height adjustment under air pressure, along with displacement sensors for maintaining optimal contact pressure and area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the polishing pad is replaced, then the polishing performance can be maintained, but the contact situation between the polishing pad and substrate changes, requiring time-consuming height adjustment operations

Engineering Contradiction:

Improvepolishing performanceVSAvoidadjustment operation time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The mechanical stopper device is pre-adjusted to the correct height position before polishing pad replacement. When the polishing pad is replaced, the head automatically returns to the pre-set height position via the stopper device, eliminating the need for time-consuming manual height adjustment operations while maintaining consistent contact pressure and area between the polishing pad and substrate

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If the head height is manually adjusted, then the contact pressure and area can be optimized, but the adjustment precision and consistency are difficult to maintain

Engineering Contradiction:

Improvecontact pressure controlVSAvoidadjustment operation

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The mechanical stopper device provides self-service height control by automatically limiting the head's downward movement to a pre-determined position. This ensures consistent contact pressure and area between the polishing pad and substrate without requiring manual measurement or adjustment operations, making the process both precise and operationally simple

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent replaces manual mechanical adjustment operations with an automated mechanical stopper device that uses a cam mechanism and adjustable stopper pin to automatically control head height. This substitution eliminates the need for operator skill and attention in height adjustment while maintaining or improving precision

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If the polishing pad contact area with substrate is increased, then the polishing speed increases, but the local polishing control capability decreases

Engineering Contradiction:

Improvepolishing speedVSAvoidlocal polishing control

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The airbag component provides dynamic height adjustment capability, allowing the polishing head to adapt its contact pressure and area with the substrate during the polishing process. This enables optimization of both polishing speed and local control by dynamically adjusting the contact parameters rather than being fixed at a single height position

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables easy and precise adjustment of the processing head height, maintaining consistent contact pressure and area, thereby enhancing polishing performance and extending the life of the polishing pad by optimizing the contact situation between the pad and the substrate.

Implementation Method 1

the mechanical stopper device includes a ball screw for moving the first member in the first direction

Methodology Applied

Scientific EffectScrew mechanism: Screw

Implementation Method 2

utilizing an air cylinder for height adjustment under air pressure

Methodology Applied

Scientific EffectPneumatic pressure: Pressurisation

Implementation Method 3

a first member that can move in a first direction which is a direction parallel to the substrate holding surface and has a first inclined surface that forms a predetermined angle with respect to the first direction and a second member that has a second inclined surface that slidably contacts the first inclined surface of the first member, the stopping surface of the second member is displaceable in a second direction perpendicular to the substrate holding surface when the first member moves in the first direction

Methodology Applied

Scientific EffectInclined plane mechanism: Inclined Plane

Data Source

PatentUS10556314B2Head height adjustment device and substrate processing apparatus provided with head height adjustment device

Publication Date: 2020.02.11 EBARA CORP

AI summary

According to one aspect, a substrate processing apparatus is provided. The substrate processing apparatus includes a table provided with a substrate holding surface for holding a substrate, a pad for processing the substrate held on the table, a head for holding the pad, an actuator for moving the head in a direction perpendicular to the substrate holding surface of the table, and a mechanical stopper device for stopping a movement of the head in the direction perpendicular to the substrate holding surface.