Dual-Claw Wafer Transfer for Dry-Wet Separation in CMP
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Solution Overview
Problem
Existing chemical-mechanical planarization devices have low wafer transmission efficiency due to the inability to transport multiple wafers simultaneously and the risk of contamination from polishing liquids during wafer transfer.
Innovation Solution
A wafer conveying device with dual claw mechanisms and transfer platforms for dry and wet wafers, allowing simultaneous clamping and loosening of wafers to separate dry and wet wafers, reducing waiting times and improving efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single manipulator and single transfer platform are used, then the device complexity is low, but the wafer transmission efficiency is low and waiting time is long
Solution Approach 1:
The single manipulator is segmented into two independent claws (first claw and second claw), each capable of independently clamping and transporting wafers. This segmentation allows parallel operation where one claw can pick up a wafer while the other delivers it, effectively doubling the transmission capacity without requiring a completely new manipulator system.
Solution Approach 2:
The transfer platform is transformed from a single horizontal surface to a multi-level structure with first and second transfer platforms arranged at different heights. This vertical dimensionality change enables simultaneous wafer placement on different levels, eliminating the sequential waiting time inherent in single-level systems.
2Reliability
If dry and wet wafers are transferred on the same platform, then the device complexity is low, but contamination occurs and yield rate decreases
Solution Approach 1:
The transfer platform is segmented into functionally distinct first and second transfer platforms, where the first platform is dedicated to dry wafers and the second platform is dedicated to wet wafers. This segmentation physically separates contamination sources, ensuring that polishing liquids from wet wafers cannot contaminate dry wafers on the first platform.
Solution Approach 2:
Different regions of the transfer system are assigned different functional qualities: the first transfer platform and first claw are optimized for dry wafer handling, while the second transfer platform and second claw are optimized for wet wafer handling. This local differentiation of quality ensures appropriate handling characteristics for each wafer type without requiring complete system redesign.
Data Source
AI summary
A wafer conveying device, a chemical-mechanical planarization device and a wafer conveying method; the wafer conveying device comprises a manipulator used to clamp and transport wafers, as well as a transfer platform used to place the wafers; the manipulator consists of a 1st claw, a 2nd claw, a lifting platform, a movement mechanism, a rotation mechanism and a control mechanism; the transfer platform consists of a 1st transfer platform, a 2nd transfer platform and an installation rack. During wafer transmission, dry-wet wafers separation can be realized to avoid contamination to the clean wafers caused by liquids such as polishing liquid carried by the polished wafers, and to improve yield rate of the wafers.