CMP Polishing Pad Light Transmission for Temperature Control

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Solution Overview

Problem

Current chemical mechanical polishing processes for semiconductor devices face challenges in effectively controlling the polishing temperature, particularly on the lower side of the polishing pad, which affects polishing efficiency and productivity.

Innovation Solution

A chemical mechanical polishing apparatus with a rotatable platen and polishing pad featuring a light irradiator and a light transmission pattern within grooves, allowing infrared light to heat the polishing slurry efficiently, thereby improving temperature control on both sides of the polishing pad.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a conventional polishing pad without light transmission features is used, then the structure is simple, but the polishing temperature cannot be controlled on the lower side of the polishing pad

Engineering Contradiction:

Improvepolishing temperatureVSAvoidpolishing pad structure

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The polishing pad incorporates a light transmission pattern with grooves that allow infrared light to pass through to the lower side of the polishing pad. This porous-like structure enables thermal energy transmission while maintaining the polishing pad's functional integrity, solving the temperature control issue without requiring complete structural redesign.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

Infrared light acts as an intermediary medium to transfer thermal energy to the polishing slurry and lower side of the polishing pad. The light transmission pattern serves as an intermediary structure that facilitates this energy transfer, enabling indirect heating without direct contact between the heat source and the polishing interface.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If the polishing temperature is not controlled, then the device complexity remains low, but the polishing efficiency and productivity deteriorate

Engineering Contradiction:

Improvepolishing efficiencyVSAvoidapparatus structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent replaces conventional mechanical or thermal heating systems with an optical-based heating system using infrared light. This substitution allows for more precise and efficient temperature control, directly improving polishing efficiency while the modular light transmission pattern keeps the added complexity manageable.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The invention changes the physical state and properties of the polishing slurry through controlled temperature increase via infrared heating. By adjusting the temperature parameter, the chemical reactivity and mechanical polishing action are enhanced, directly improving productivity.

Inventive Principle:

Principle #35Parameter changes

3Productivity

If the polishing slurry is not heated, then the energy consumption is low, but the polishing efficiency deteriorates

Engineering Contradiction:

Improvepolishing efficiencyVSAvoidenergy consumption

Core Design Contradiction:

ProductivityVSUse of energy by moving object

Solution Approach 1:

The infrared heating system utilizes thermal energy to increase the temperature of the polishing slurry, potentially inducing phase transitions or changes in the slurry's physical properties that enhance its polishing capability. This targeted energy application improves efficiency while consuming less total energy compared to heating the entire system.

Inventive Principle:

Principle #36Phase transitions

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances polishing efficiency by uniformly heating the polishing slurry, improving the control of polishing temperature and resulting in improved productivity and quality of semiconductor devices.

Implementation Method 1

a light irradiator in the platen, the light irradiator configured to irradiate light toward the polishing pad

Methodology Applied

Scientific EffectInfrared radiation heating: Infrared Radiation

Implementation Method 2

the polishing pad includes a light transmission pattern within at least some of the plurality of grooves and through which the light is transmitted from the light irradiator

Methodology Applied

Scientific EffectLight transmission: Light

Data Source

PatentUS20240145254A1Chemical mechanical polishing apparatus and method of fabricating semiconductor device using the same

Publication Date: 2024.05.02 SAMSUNG ELECTRONICS CO LTD

AI summary

A chemical mechanical polishing apparatus capable of controlling polishing temperature, and a method of fabricating a semiconductor device using the same are provided. The chemical mechanical polishing apparatus includes a platen, a polishing pad on the platen, the polishing pad including a plurality of grooves, and a light irradiator in the platen, the light irradiator configured to irradiate light toward the polishing pad, wherein the polishing pad includes a light transmission pattern interposed between at least some of the plurality of grooves and the light irradiator and through which the light is transmitted.