CMP Steam Cleaning Cup for Pad Temperature Uniformity
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Solution Overview
Problem
Chemical mechanical polishing (CMP) processes face challenges with temperature variations across the polishing pad, leading to within-wafer non-uniformity and wafer-to-wafer non-uniformity, as well as issues with debris and slurry accumulation causing defects, which current water-based cleaning methods struggle to address efficiently.
Innovation Solution
The implementation of a steam treatment system that uses dry steam to clean and preheat components of the CMP apparatus, including carrier heads and conditioner disks, to reduce temperature variations and effectively remove polishing by-products, utilizing nozzles to direct steam for efficient energy transfer and cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If water-based cleaning methods are used to remove debris and slurry accumulation, then cleaning function is provided, but cleaning efficiency is insufficient and defects remain
Solution Approach 1:
The patent changes the physical state of the cleaning medium from liquid water to gaseous steam. This parameter change enables more effective removal of debris and slurry accumulation while improving cleaning efficiency. The steam's high temperature and gas phase properties enhance its ability to dissolve and remove polishing by-products compared to conventional water-based methods.
Solution Approach 2:
The patent utilizes the phase transition of water from liquid to gas (steam) to achieve superior cleaning performance. The steam generation system converts liquid water into steam, which then contacts the polishing pad and carrier head surfaces. This phase transition provides higher energy transfer and more effective removal of contaminants while reducing the quantity of cleaning fluid required.
2Manufacturing precision
If steam treatment is used to clean and preheat components, then temperature control is improved and cleaning efficiency increases, but system complexity increases
Solution Approach 1:
The steam generation and delivery system serves multiple functions: it cleans the polishing pad and carrier head surfaces, preheats components to reduce temperature variations, and removes debris and slurry accumulation. By consolidating these functions into a single steam treatment system, the patent achieves improved polishing uniformity while managing system complexity through multi-functionality rather than adding separate systems for each function.
Solution Approach 2:
The patent introduces steam as an intermediary medium that transfers thermal energy and cleaning action to the polishing pad and carrier head. This intermediary approach enables temperature control and cleaning without direct contact of liquid water, reducing temperature variations across the polishing pad and improving polishing uniformity while maintaining manageable system complexity through a centralized steam generation system.
3Reliability
If large quantities of cleaning fluid are used to remove debris and slurry, then cleaning coverage is improved, but fluid consumption and waste increase
Solution Approach 1:
The patent changes the cleaning medium from liquid water to gaseous steam, which provides superior cleaning coverage with significantly reduced fluid consumption. The steam's gas phase properties enable it to penetrate and contact surfaces more effectively, dissolving and removing debris and slurry residues without requiring large quantities of liquid. This parameter change reduces both cleaning fluid consumption and waste while maintaining or improving defect removal effectiveness.
Solution Approach 2:
By utilizing the phase transition to steam, the system achieves efficient cleaning with minimal fluid consumption. The steam generation process converts a small amount of liquid water into a large volume of gas that can cover and treat extensive surfaces. This phase transition enables the system to provide adequate cleaning coverage and defect removal while dramatically reducing the quantity of cleaning fluid required compared to liquid water-based methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces defects and improves polishing uniformity by tightly controlling the temperature of the polishing pad, enhancing the predictability of the CMP process and reducing the need for large quantities of cleaning fluid, while effectively dissolving and removing debris and slurry residues.
Implementation Method 1
a boiler to generate steam
Implementation Method 2
one or more nozzles positioned to direct steam inwardly into the cavity defined by the load cup
Implementation Method 3
directing steam onto the carrier head and/or substrate in the loading cup to clean and/or preheat the carrier head and/or substrate
Data Source
AI summary
An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system includes a conditioner cleaning cup, a boiler to generate steam, one or more nozzles positioned to direct steam inwardly into a cavity defined by the load cup, and a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.