Polishing Pad Thermal Conduction Structure for CMP Temperature Control

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Solution Overview

Problem

Existing methods struggle to effectively control the temperature of polishing pads during chemical mechanical polishing processes due to their insulating properties, which hinders process efficiency and reliability.

Innovation Solution

Incorporating a thermal conductive body into the polishing pad, enhancing thermal coupling with the polishing platen through fluid channels, allowing for rapid and precise temperature control of the polishing pad.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a polishing pad is used to insulate thermal energy, then the polishing pad maintains stable temperature, but the temperature control of the polishing pad becomes difficult

Engineering Contradiction:

Improvetemperature stabilityVSAvoidtemperature control

Core Design Contradiction:

Stability of the object's compositionVSEase of operation

Solution Approach 1:

The polishing pad is constructed as a composite structure combining a polishing layer (providing insulation and polishing function) with a temperature control layer containing thermal conductive particles (enabling heat transfer). This composite material approach allows the pad to simultaneously maintain thermal stability during polishing while enabling active temperature control through the conductive pathway.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The temperature control layer is positioned at the bottom surface of the polishing pad, creating a localized thermal conductive pathway. This local quality modification allows heat to be efficiently transferred from the polishing platen to the pad at the contact interface, while the upper polishing layer maintains its insulating properties to stabilize the overall pad temperature during operation.

Inventive Principle:

Principle #3Local quality

2Reliability

If the polishing pad acts as a thermal insulating material, then the polishing pad protects the substrate from temperature fluctuations, but the temperature of the polishing pad cannot be controlled

Engineering Contradiction:

Improvetemperature protectionVSAvoidtemperature control

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The dual-layer composite structure with thermal conductive particles in the temperature control layer enables the pad to simultaneously provide thermal protection to the substrate while allowing active temperature control through the conductive pathway at the platen interface.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The temperature control layer acts as an intermediary between the polishing platen and the polishing layer. It mediates heat transfer from the platen to the pad, enabling temperature control while the polishing layer continues to provide thermal protection to the substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If a thermal conductive body is added to the polishing pad, then the temperature control efficiency is improved, but the structure of the polishing pad becomes more complex

Engineering Contradiction:

Improvetemperature control efficiencyVSAvoidpad structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The thermal conductive particles are integrated into the temperature control layer as a composite material solution. This approach enhances thermal conductivity without requiring separate discrete components, thereby improving temperature control efficiency while minimizing structural complexity.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The thermal conductivity parameter of the polishing pad is modified by incorporating thermal conductive particles into the temperature control layer. This parameter change enables efficient heat transfer from the platen to the pad, improving temperature control efficiency without fundamentally altering the basic pad structure.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves the efficiency and reliability of the polishing process by enabling quicker and more effective temperature control of the polishing pad, enhancing thermal coupling with the platen.

Implementation Method 1

a thermal conductive body provided in the trench of the pad body and connected to the first surface of the polishing platen

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a polishing platen including a fluid channel

Methodology Applied

Scientific EffectFluid flow: Convection

Data Source

PatentUS12551982B2Polishing pad and substrate processing apparatus including the same

Publication Date: 2026.02.17 SAMSUNG ELECTRONICS CO LTD

AI summary

A substrate processing apparatus includes a polishing platen including a fluid channel, a polishing pad provided on a first surface of the polishing platen, the polishing pad including a pad body including a trench and a thermal conductive body provided in the trench of the pad body and connected to the first surface of the polishing platen, and a polishing head provided on the polishing pad and configured to support a substrate.