CMP End-Point Detection With Insulated AE Sensor Mounting
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Solution Overview
Problem
Existing semiconductor manufacturing devices face challenges in accurately determining the polishing end point during chemical mechanical polishing (CMP) processes, leading to potential errors due to noise interference from conductive components affecting the acoustic emission sensor's signal-to-noise ratio.
Innovation Solution
The device incorporates insulating first and second members to isolate the acoustic emission sensor from conductive components, using fastening members with insulating materials and anti-vibration mechanisms to minimize noise interference, allowing precise detection of the polishing end point.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the acoustic emission sensor is placed in contact with conductive components for signal transmission, then electrical connectivity is achieved, but noise interference increases and signal-to-noise ratio deteriorates
Solution Approach 1:
An insulating member is introduced as an intermediary between the acoustic emission sensor and the turntable. This insulating member allows mechanical support and signal transmission while blocking electrical noise from the conductive turntable from reaching the sensor, thereby improving the signal-to-noise ratio without compromising connectivity.
Solution Approach 2:
The harmful electrical noise is extracted or separated from the signal transmission path by using the insulating member. The insulating member selectively transmits mechanical vibrations (useful signal) while blocking electrical noise (harmful factor), effectively removing the noise interference from the sensor input.
2Reliability
If fastening members with insulating materials are used to secure the sensor, then noise interference is reduced, but assembly complexity increases
Solution Approach 1:
The fastening function and the insulation function are merged into a single insulating member. This member simultaneously secures the acoustic emission sensor to the turntable and provides electrical isolation, eliminating the need for separate fastening hardware and insulating components, thus reducing overall assembly complexity while maintaining noise reduction benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables accurate determination of the polishing end point by effectively filtering out control signals and reducing vibration transmission, thereby enhancing the precision of CMP processes.
Implementation Method 1
a first AE sensor to come into contact with the second member
Implementation Method 2
a first member to come into contact with the turntable or top ring; a second member to come into contact with the polishing pad or suction mechanism and with the turntable or top ring via the first member
Data Source
AI summary
A semiconductor manufacturing device includes: a turntable configured to be rotatable and having a first surface; a polishing pad provided on the first surface; a first support portion configured to rotatably hold the turntable; a top ring having a second surface and including a suction mechanism that holds an object to be processed on the second surface; a second support portion configured to rotatably hold the top ring; a first member to come into contact with the turntable or top ring; a second member to come into contact with the polishing pad or suction mechanism and with the turntable or top ring via the first member; and a first AE sensor to come into contact with the second member.