CMP Cleaning Brush with Tilted Outlet Channels for Uniform Flow

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Solution Overview

Problem

The non-planar surfaces of semiconductor substrates after chemical-mechanical polishing (CMP) processes lead to contamination issues, such as slurry particles, organic residues, and metallic impurities, which can cause defects in subsequent processing steps, necessitating an effective cleaning solution.

Innovation Solution

A cleaning brush design with a core and brush member, featuring a circumferential portion with tilted outlet channels and varying cross-sections and tilt angles to ensure uniform fluid distribution, enhancing cleaning efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional cleaning brush is used after CMP process, then the brush structure is simple, but the cleaning uniformity is poor due to non-planar substrate surface

Engineering Contradiction:
Improvecleaning uniformityVSAvoidbrush structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by varying the outlet channel geometry (width, tilt angle, cross-sectional shape) at different locations along the core to match the non-planar substrate surface characteristics. This ensures uniform fluid distribution and cleaning performance across the entire substrate area, addressing the varying contamination removal needs different regions have after CMP processing.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent implements dynamics by making the outlet channel parameters adjustable or variable along the length of the core. The outlet channels can have different widths, tilt angles, and cross-sectional shapes at different positions, allowing the brush to adapt dynamically to the non-planar substrate surface and maintain consistent cleaning uniformity throughout the substrate area.

Inventive Principle:
Principle #15Dynamics

2Manufacturing precision

If the outlet channels are tilted outwardly toward the closed end portion, then the fluid distribution is improved, but the manufacturing complexity increases

Engineering Contradiction:
Improvefluid distribution uniformityVSAvoidcore manufacturing difficulty
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent applies parameter changes by systematically varying the outlet channel geometry parameters (tilt angle, width, cross-sectional shape) along the length of the core. This controlled variation in parameters optimizes fluid distribution uniformity across the substrate while the systematic nature of the changes allows for efficient manufacturing through precision molding or machining processes.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If the total volume of elongated conduit and outlet channels decreases gradually from inlet to closed end, then the cleaning efficiency is improved, but the device complexity increases

Engineering Contradiction:
Improvecleaning efficiencyVSAvoidcore internal structure complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent applies local quality by creating different zones along the core with varying total volumes of elongated conduit and outlet channels. The first zone near the inlet has a larger total volume, while subsequent zones have progressively smaller volumes. This zonal variation optimizes cleaning efficiency by ensuring adequate fluid distribution throughout the brush while maintaining a manageable overall structure.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The brush achieves consistent and reduced cleaning time with improved uniformity, effectively removing contaminants from semiconductor substrates, thereby reducing defects and increasing yield.

Implementation Method 1

the circumferential portion includes a plurality of outlet channels passing therethrough to fluidly communicate with the elongated conduit, the outlet channels being tilted outwardly toward the closed end portion

Methodology Applied
Scientific EffectFluid flow:

Data Source

PatentUS12615988B2Cleaning brush for semiconductor fabrication process
Publication Date: 2026.04.28 ENTEGRIS INC
  • US12615988B2 patent drawing
  • US12615988B2 patent drawing
  • US12615988B2 patent drawing

AI summary

A cleaning brush for a semiconductor fabrication process is provided. The cleaning brush includes a core and a brush member. The core includes a circumferential portion and a closed end portion. The circumferential portion surrounds a rotation axis of the cleaning brush and defines an inlet opening for receiving a fluid. The closed end portion is connected to an end of the circumferential portion that is opposite to the inlet opening along the rotation axis. At least one elongated conduit is defined within the core and fluidly communicated with the inlet opening, and the circumferential portion includes a plurality of outlet channels passing therethrough to fluidly communicate with the elongated conduit, the outlet channels being tilted outwardly toward the closed end portion. The brush member is connected to an outer surface of the circumferential portion and covers all of the outlet channels.