Substrate Cleaning Device for Semiconductor Polishing
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Solution Overview
Problem
Particles adhering to semiconductor substrates and polishing equipment after polishing treatments pose challenges for complete removal, affecting yield and requiring immediate cleaning to prevent adherence and contamination.
Innovation Solution
A substrate cleaning device with a polishing table and top ring that moves between polishing and handover positions, equipped with first and second spray units for cleaning liquids, and a control system to coordinate cleaning operations, ensuring efficient removal of particles from substrates, retainer rings, and polishing surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is conveyed from the polishing module to the cleaning module, then the substrate can be cleaned in a dedicated cleaning area, but particles may dry out and adhere firmly to the substrate surface, making complete particle removal difficult
Solution Approach 1:
The invention applies preliminary action by performing cleaning treatment on the substrate immediately after polishing, before particles have time to dry out and adhere firmly. The cleaning module is positioned to receive substrates directly from the polishing module, and cleaning liquids are sprayed onto the substrate surface right away to prevent particle adhesion, thereby ensuring complete particle removal while minimizing conveyance time.
2Reliability
If multiple cleaning modules are used for rough cleaning and fine cleaning, then particle removal effectiveness is improved, but the device complexity and cleaning process time increase
Solution Approach 1:
The invention applies segmentation by dividing the cleaning process into two distinct stages: rough cleaning (primary cleaning) and fine cleaning (secondary cleaning). Different cleaning modules are configured with different functions - some for removing bulk particles and others for fine particle removal. This segmented approach improves particle removal effectiveness while maintaining manageable device complexity through functional specialization.
Solution Approach 2:
The cleaning modules are designed with multi-functionality to perform both rough and fine cleaning operations. By configuring cleaning modules that can handle multiple cleaning tasks, the system achieves comprehensive particle removal without requiring an excessive number of separate modules, thereby balancing effectiveness with device complexity.
3Reliability
If cleaning treatment is performed on the polishing head and retainer ring, then contamination of the next substrate is prevented, but additional cleaning time and complexity are required
Solution Approach 1:
The invention merges the cleaning operations for the substrate, polishing head, and retainer ring into a unified cleaning process. The cleaning module is configured to simultaneously clean all three components using spray nozzles that direct cleaning liquid onto the substrate surface, polishing head, and retainer ring. This combined cleaning approach prevents contamination of the next substrate while minimizing additional cleaning time and process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates effective and efficient removal of particles from substrates and equipment, improving yield by ensuring thorough cleaning and preventing contamination during the polishing process.
Implementation Method 1
a first spray unit for spraying a cleaning liquid toward the substrate, the membrane, and the retainer ring at the cleaning position
Implementation Method 2
a second spray unit for spraying a rinse liquid toward the substrate at the cleaning position
Data Source
AI summary
A substrate cleaning device and a substrate polishing device are provided. The substrate cleaning device is provided in a substrate polishing device, which includes a polishing table having a polishing surface for polishing a substrate and a top ring holding the substrate with a membrane while surrounding an outer peripheral part of the substrate with a retainer ring, and cleaning the surface after polishing. The top ring is freely movable between a substrate polishing position above the table and a substrate handover position at a side of the table. The substrate cleaning device is provided corresponding to a cleaning position between the polishing and handover positions, and includes a first spray unit including cleaning nozzles for spraying cleaning liquid on the substrate, membrane, and retainer ring at the cleaning position; and a second spray unit including a substrate rinse nozzle spraying rinse liquid onto the substrate at the cleaning position.