CMP Atomizer Nozzles for Oxygen-Reduced Cleaning Liquid

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Solution Overview

Problem

Metal layers on semiconductor substrates are prone to corrosion and galvanic coupling due to the presence of undesired dissolved oxygen in cleaning liquids during chemical mechanical polishing (CMP) processes, leading to high contact resistance and opens in contacts and lines.

Innovation Solution

Implementing gas/liquid atomizer nozzles in CMP modules that adjust gas and liquid flows to match desired recipes, allowing for degassing of cleaning liquids and simultaneous purging of oxygen, thereby preventing oxygen diffusion and corrosion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If cleaning liquid is supplied to clean the substrate, then cleaning effectiveness is improved, but dissolved oxygen in the cleaning liquid causes corrosion and galvanic coupling of metal layers

Engineering Contradiction:
Improvecleaning effectivenessVSAvoidcorrosion and galvanic coupling
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent removes dissolved oxygen from the cleaning liquid through vacuum degassing before the cleaning process. This extraction of the harmful component (oxygen) allows the cleaning liquid to maintain its cleaning effectiveness while eliminating the corrosion-causing element, directly resolving the technical contradiction between cleaning effectiveness and corrosion prevention.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces an inert atmosphere (nitrogen or other inert gas) into the cleaning liquid after degassing to replace the removed oxygen. This creates an oxygen-free environment that prevents corrosion and galvanic coupling while maintaining the cleaning liquid's ability to clean the substrate effectively, thus resolving the contradiction between cleaning performance and corrosion protection.

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

2Reliability

If vacuum degassing is used to remove dissolved oxygen from cleaning liquid, then corrosion prevention is improved, but processing time is increased

Engineering Contradiction:
Improvecorrosion preventionVSAvoidprocessing time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent performs vacuum degassing of the cleaning liquid in advance, before the actual substrate cleaning process begins. This preliminary removal of dissolved oxygen ensures that the cleaning liquid is ready for immediate use without oxygen-induced corrosion, while the time penalty is paid beforehand rather than during substrate processing, thus minimizing the impact on overall processing time.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system maintains a continuous supply of pre-degassed cleaning liquid through a reservoir and pumping system. Once the cleaning liquid is degassed, it can be continuously circulated and reused for multiple substrates without repeating the time-consuming degassing process, thereby reducing the time loss per substrate while maintaining continuous corrosion protection.

Inventive Principle:
Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of atomizer nozzles minimizes corrosion and galvanic coupling by reducing dissolved oxygen in cleaning fluids, ensuring cleaner substrate surfaces and effective particle removal.

Implementation Method 1

gas/liquid atomizer nozzles in CMP modules that adjust gas and liquid flows to match desired recipes, allowing for degassing of cleaning liquids

Methodology Applied
Scientific EffectAtomization:

Implementation Method 2

The cleaning liquid may be vacuum degassed prior to being flowed into a cleaning module to remove dissolved oxygen

Methodology Applied
Scientific EffectVacuum degassing: Vacuum

Implementation Method 3

The cleaning module environment may be purged with an inert gas, such as nitrogen, to prevent oxygen diffusion into the cleaning liquid

Methodology Applied
Scientific EffectInert gas purging:

Data Source

PatentUS20250353042A1Atomization of cleaning liquid dispense in cleaner modules
Publication Date: 2025.11.20 APPLIED MATERIALS INC
  • US20250353042A1 patent drawing
  • US20250353042A1 patent drawing
  • US20250353042A1 patent drawing

AI summary

Embodiments herein generally relate to cleaning systems used with CMP systems and methods related thereto having atomizer nozzles. In an embodiment, a substrate processing system includes a polishing module including a transfer station and one or more polishing stations, the one or more polishing stations including at least one first nozzle configured to atomize a first cleaning liquid, a cleaning module including a brush cleaner, and a controller coupled to the polishing module and the cleaning module. In another embodiment, a substrate processing system includes a polishing module, a cleaning module having a brush cleaner at least one nozzle disposed within the brush cleaner, and a controller coupled to the polishing module and the cleaning module. The controller is configured to spray a substrate using the at least one nozzle of the brush cleaner where the at least one nozzle is configured to atomize a cleaning fluid.