CMP Apparatus with Bidirectional Rotation Member for Polishing Distribution Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing chemical mechanical polishing (CMP) apparatuses face challenges in precisely controlling the polishing distribution on substrates, leading to deviations from average values and difficulties in achieving precise control.
Innovation Solution
The proposed chemical mechanical polishing apparatus includes a substrate support plate, a rotation member with a polishing pad, and a jig member that is movably connected to the rotation member. This configuration allows for precise control of the polishing distribution by enabling the rotation member to be precisely moved and slurry to be directly supplied onto the substrate through nozzles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a general CMP process is used, then the polishing process can be performed, but polishing distribution on the substrate deviates from average value and precise control becomes difficult
Solution Approach 1:
The polishing pad is divided into multiple regions with different polishing characteristics. The rotation member includes a first rotation region and a second rotation region that rotate in opposite directions, creating localized polishing zones with different pressure and motion patterns, enabling precise control of polishing distribution across different substrate areas
Solution Approach 2:
The apparatus introduces dynamic motion control by making the rotation member rotate in opposite directions in different regions. The first and second rotation regions can independently control rotation speed and direction, creating dynamic polishing patterns that adapt to different substrate areas, thereby achieving precise polishing distribution control
2Manufacturing precision
If the rotation member rotates in a single direction, then the polishing process is simple, but polishing distribution cannot be precisely controlled
Solution Approach 1:
The rotation member employs dynamic bidirectional rotation where the first rotation region rotates in one direction while the second rotation region rotates in the opposite direction. This dynamic motion control allows precise adjustment of polishing distribution by varying rotation speeds and directions in different regions, achieving superior polishing uniformity
Solution Approach 2:
Different regions of the rotation member are assigned different rotation directions and speeds to create localized polishing characteristics. The first rotation region and second rotation region have tailored motion parameters suited for specific substrate areas, enabling precise control of polishing distribution across the entire substrate surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves precise control over polishing distribution on substrates, improving the accuracy and efficiency of the CMP process by allowing for targeted polishing and uniform slurry application.
Implementation Method 1
a substrate support plate configured to adsorb and fix the substrate by providing pressure to the substrate
Implementation Method 2
a rotation member configured to include a polishing pad positioned on the substrate support plate to polish the substrate
Implementation Method 3
a slurry supplier positioned on the polishing pad and including a slurry supply valve positioned to surround the polishing pad, and the slurry supply valve includes at least one nozzle for directly supplying slurry onto the substrate
Data Source
AI summary
A chemical mechanical polishing apparatus including a substrate support plate configured to support a substrate, a rotation member positioned on the substrate support plate and configured to include a polishing pad for polishing the substrate, and a jig member positioned on the substrate support plate and movably connected to the rotation member.