CMP Buff Pad Cleaning Layout to Prevent Clogging and Contamination

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Solution Overview

Problem

Conventional CMP apparatuses face challenges in effectively cleaning and maintaining the buff pad and dresser due to clogging, which reduces polishing and cleaning performance, and the installation of atomizers is hindered by the size difference between the buff pad and dresser, leading to contamination of the wafer and increased processing time.

Innovation Solution

The apparatus incorporates a buff process module with a buff table that includes a nozzle for chemical solution cleaning, a stage film, and a conveyor mechanism, allowing for enhanced cleaning through multiple methods such as physical contact, fluid passage, and use of atomizers, ultrasonic cleaners, and cavitation jet cleaners to maintain cleanliness of the support surface and conveyor components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a buff pad and dresser are used in a CMP apparatus, then polishing and cleaning performance is improved, but the buff pad and dresser become clogged, reducing performance

Engineering Contradiction:

Improvepolishing and cleaning performanceVSAvoidclogging of buff pad and dresser

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies preliminary action by performing cleaning of the buff pad and dresser before the polishing process to prevent clogging. The cleaning unit cleans the buff pad and dresser in advance, ensuring they are free from contaminants before polishing begins, thus maintaining optimal polishing and cleaning performance throughout the process.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If atomizers are installed to clean the buff pad, then cleaning effectiveness is improved, but the size difference between buff pad and dresser prevents proper installation

Engineering Contradiction:

Improvecleaning effectivenessVSAvoidinstallation complexity due to size difference

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies universality by designing a cleaning unit that can clean both the buff pad and dresser using the same atomizer mechanism. The cleaning unit is positioned and configured to accommodate both components despite their size differences, allowing a single cleaning system to serve multiple functions and maintain both components effectively.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If the cleaning unit is positioned to clean the buff pad, then buff pad cleanliness is improved, but the wafer may be contaminated by cleaning solution

Engineering Contradiction:

Improvebuff pad cleanlinessVSAvoidwafer contamination by cleaning solution

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by positioning the cleaning unit and atomizers to target specific areas - the buff pad and dresser - while avoiding the wafer area. The cleaning operations are localized to where they are needed, with controlled spray directions and positioning that ensure cleaning effectiveness on the buff pad and dresser without allowing cleaning solution to reach and contaminate the wafer.

Inventive Principle:

Principle #3Local quality

4Reliability

If multiple cleaning methods are used (physical contact, fluid passage, atomizers), then thorough cleaning is achieved, but processing time increases

Engineering Contradiction:

Improvethoroughness of cleaningVSAvoidprocessing time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent applies merging by combining multiple cleaning methods - physical contact cleaning, fluid passage cleaning, and atomizer-based cleaning - into a single integrated cleaning unit. This allows all cleaning actions to be performed simultaneously or in a coordinated sequence on both the buff pad and dresser, achieving thorough cleaning without the time penalty of separate cleaning operations for each component.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures thorough cleaning of the buff pad and support surface, reducing contamination and processing time, while maintaining the integrity of the wafer and improving the efficiency of the polishing process.

Implementation Method 1

a nozzle for supplying the support surface with a chemical solution for cleaning the support surface of the buff table

Methodology Applied

Scientific EffectChemical cleaning:

Implementation Method 2

an atomizer that jets a high pressure cleaning fluid to the buff pad

Methodology Applied

Scientific EffectHigh pressure fluid jetting: Jet

Implementation Method 3

ultrasonic cleaners

Methodology Applied

Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Implementation Method 4

cavitation jet cleaners

Methodology Applied

Scientific EffectCavitation: Cavitation

Data Source

PatentUS12350787B2Substrate processing apparatus

Publication Date: 2025.07.08 EBARA CORP

AI summary

An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.