Chemical Mechanical Polishing Device Cleaning Assembly
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Solution Overview
Problem
Chemical mechanical polishing devices face contamination issues due to water vapor and slurry adherence, leading to equipment corrosion and wafer defects, as well as inefficiencies in cleaning the carrier head and temperature adjuster surfaces during semiconductor manufacturing processes.
Innovation Solution
A chemical mechanical polishing device is designed with a cleaning assembly featuring a frame with a driving roller and a reciprocating cleaning assembly, including brushes and nozzles, to effectively remove contaminants from the carrier head and temperature adjuster surfaces, while a temperature control system adjusts the polishing pad temperature to prevent water vapor accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cleaning process is performed to remove contaminants, then cleaning efficiency is improved, but equipment complexity increases due to the need for additional cleaning assemblies and mechanisms
Solution Approach 1:
The cleaning assembly combines multiple cleaning functions into a single integrated unit that includes brushes for mechanical cleaning, nozzles for fluid喷射, and heating elements for thermal treatment. This merging of multiple cleaning mechanisms into one assembly improves cleaning efficiency while minimizing the increase in overall equipment complexity compared to having separate cleaning devices for each function.
Solution Approach 2:
The cleaning assembly is designed to perform multiple cleaning functions simultaneously - mechanical brushing, fluid spraying, and heating - making it a multi-functional device that can handle various types of contaminants on different surfaces (carrier head, temperature adjuster, polishing pad). This universality reduces the need for multiple specialized cleaning devices, thereby improving cleaning efficiency without proportionally increasing equipment complexity.
2Reliability
If water vapor and slurry are removed from surfaces, then equipment corrosion is prevented, but cleaning time increases due to the need for thorough cleaning of multiple components
Solution Approach 1:
The cleaning assembly performs preliminary cleaning actions by simultaneously applying multiple cleaning mechanisms (brushes, nozzles, heating elements) to surfaces before contaminants can cause corrosion or before the equipment needs to be shut down for maintenance. This preliminary action removes water vapor and slurry promptly, preventing corrosion while minimizing the time needed for subsequent thorough cleaning operations.
Solution Approach 2:
The cleaning assembly is designed to operate continuously during the semiconductor manufacturing process, constantly removing water vapor and slurry from surfaces as they are generated. This continuous cleaning action prevents equipment corrosion without requiring separate dedicated cleaning time, thereby maintaining reliability while minimizing loss of productive time.
3Manufacturing precision
If the polishing pad temperature is controlled to prevent water vapor accumulation, then wafer defects are reduced, but energy consumption increases due to continuous temperature adjustment
Solution Approach 1:
The temperature control system uses feedback mechanisms to monitor the polishing pad temperature and adjust heating or cooling accordingly. This feedback control ensures the temperature is maintained within optimal ranges to prevent water vapor accumulation and wafer defects, while minimizing energy consumption by only applying temperature control when and where needed, rather than continuous full-power operation.
Solution Approach 2:
The temperature control system applies temperature adjustment locally to specific areas of the polishing pad where water vapor accumulation is most likely to occur, rather than uniformly heating or cooling the entire pad. This local quality approach reduces energy consumption while still effectively preventing wafer defects in the critical areas where contamination occurs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device efficiently cleans contaminants and prevents equipment corrosion, ensuring proper wafer attachment and surface temperature control, thereby enhancing the semiconductor manufacturing process by maintaining a clean environment and reducing defects.
Implementation Method 1
a driving roller arranged in the lower space and configured to rotate in place
Implementation Method 2
a cleaning assembly arranged in the upper space and configured to reciprocate in a first horizontal direction... the cleaning assembly includes a plurality of brushes
Implementation Method 3
a plurality of nozzles arranged respectively between the plurality of brushes
Implementation Method 4
a temperature adjuster configured to spray, onto the polishing pad, a temperature control fluid for adjusting a temperature of the polishing pad
Data Source
AI summary
A chemical mechanical polishing device includes a frame providing lower and upper spaces in the frame and including a flat plate portion that separates the lower and upper spaces from each other and has a first hole, a driving roller in the lower space and configured to rotate in place, a cleaning assembly in the upper space and configured to reciprocate in a first horizontal direction parallel to an upper surface of the flat plate portion, and a driver extending from the upper space to the lower space through the first hole of the flat plate portion and having one end connected to a base of the driving roller and the other end opposite to the one end and connected to the cleaning assembly, wherein the cleaning assembly includes brushes arranged apart from each other in the first horizontal direction and nozzles arranged respectively between the brushes.