Lapping Machines TRIZ Cases

Applying a conical curvature to the polishing pad prevents stepped profile formation, ensuring consistent workpiece planarization quality.

A suction system extracts pad conditioner debris and slurry from the CMP pad to prevent wafer damage and equipment failure during planarization.

Segmented carrier apparatus with exchangeable notch trigger reduces structural complexity and material costs while maintaining high precision during grinding.

A carrying pad maintains a water layer between itself and the wafer using surface tension to keep the workpiece wet during transport.

Dual nozzle substrate cleaning system ejects temperature-controlled liquid to remove particles from wafer surfaces during rinsing.

An air bearing protects the front surface from contamination while polishing the backside, eliminating extra cleaning steps.

A controller adjusts annular platen flexure deflection and carrier head dwell times to optimize material removal profiles during chemical mechanical polishing.

A hand cleaning unit injects fluid to remove foreign materials from substrate handling components.

Digitizing detection and dummy coil signals via digital processing reduces ambient environmental influence on film thickness accuracy.

Movable arrangement parts in the load cup align the wafer center with the polishing head, resolving CMP misalignment issues.

A spacer supports a solid light-transmissive window in a polishing pad to maintain optical path integrity.

A substrate processing apparatus routes production wafers around active test sections to maintain throughput during maintenance cycles.

A polishing method moves an upper plate along a quadrangular path to ensure uniform material removal across the substrate surface.

Direct-contact temperature control prevents slurry dilution while grooves flush debris from the substrate holder.

Segmented barrier ring with flexible seals contains liquid treatment compositions, reducing diamond slurry wastage during lapping plate processing.

Non-uniform thickness distribution in a convex glass article prevents warping and sagging during conveyance while maintaining thinness.

Integrated cleaning assembly with reciprocating brushes and nozzles prevents equipment corrosion and wafer defects in chemical mechanical polishing.