CMP Suction System for Debris Removal

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Solution Overview

Problem

Chemical mechanical planarization (CMP) systems are susceptible to equipment failure and damage to semiconductor wafers due to debris from pad conditioners and slurry crystallization.

Innovation Solution

A suction system is integrated into the CMP system to remove pad conditioner debris and slurry from the CMP pad before they can damage the wafer or equipment, thereby preventing equipment failure and increasing wafer yields.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If chemical mechanical planarization is performed using a rotating CMP pad and slurry, then the semiconductor wafer surface is planarized enabling smaller feature sizes, but debris from pad conditioners and slurry crystallization can damage the wafer or equipment

Engineering Contradiction:

Improvesurface planarityVSAvoiddebris damage

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The suction system extracts and removes debris particles and slurry from the CMP pad surface during the planarization process, preventing these harmful factors from damaging the semiconductor wafer or equipment while maintaining the planarization function

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The suction system acts as an intermediary between the CMP pad and the semiconductor wafer, intercepting and removing debris before it can contact the wafer, thus protecting the wafer while allowing the planarization process to continue

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a suction system is added to remove debris during CMP, then equipment reliability and wafer yield are improved, but system complexity increases

Engineering Contradiction:

Improveequipment reliabilityVSAvoidsystem complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The suction system is designed to perform multiple functions: removing debris particles, eliminating slurry residue, and preventing both types of damage simultaneously, thereby achieving improved reliability without requiring multiple separate systems

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The suction system continuously operates during the CMP process to automatically remove debris and slurry as they are generated, providing self-service protection without requiring additional manual intervention or complex control systems

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The suction system effectively prevents damage to semiconductor wafers and CMP equipment by removing debris and slurry, reducing the need for repairs and increasing overall system efficiency.

Implementation Method 1

A suction system is integrated into the CMP system to remove pad conditioner debris and slurry from the CMP pad

Methodology Applied

Scientific EffectSuction: Suction

Data Source

PatentUS12311501B2System and method for removing debris during chemical mechanical planarization

Publication Date: 2025.05.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A chemical mechanical planarization system includes a chemical mechanical planarization pad that rotates during a chemical mechanical planarization process. A chemical mechanical planarization head places a semiconductor wafer in contact with the chemical mechanical planarization pad during the process. A slurry supply system supplies a slurry onto the pad during the process. A pad conditioner conditions the pad during the process. A suction system removes pad conditioner debris and the slurry from the pad.