CMP Substrate Processing Control for Parallel Testing
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Solution Overview
Problem
Existing substrate processing apparatuses reduce processing efficiency when conducting tests on polishing or cleaning sections, as production substrate processing is halted to perform tests, leading to inefficiencies.
Innovation Solution
A substrate processing apparatus with a control section that manages transfer units to set modes for maintenance, testing, and normal operations, allowing for continuous production processing by routing production substrates around testing sections and using separate test substrates for testing sections, thereby optimizing transfer and processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a test is conducted on a polishing section or cleaning section while production processing continues, then the substrate processing efficiency is improved, but production substrates may be transferred to the test target section causing test interference
Solution Approach 1:
The system segments substrate types into production substrates and test substrates, and segments processing sections into test target sections and non-test target sections. The transfer unit is controlled to route production substrates to non-test target sections and test substrates to test target sections, allowing simultaneous production and testing without interference.
Solution Approach 2:
The transfer unit acts as an intermediary that intelligently routes substrates based on their type and the operational status of processing sections. It mediates between production substrate flow and test substrate flow, ensuring that production substrates bypass test target sections while test substrates are directed to them.
2Reliability
If production processing is stopped to conduct a test on a polishing section or cleaning section, then test accuracy is improved, but substrate processing efficiency is reduced
Solution Approach 1:
The system maintains continuous production processing by routing production substrates through non-test target sections while test substrates are simultaneously processed in test target sections. This allows testing to be conducted without interrupting the continuous flow of production substrate processing.
Solution Approach 2:
The processing system is segmented into parallel pathways: one for production substrates through non-test target sections and another for test substrates through test target sections. This segmentation enables independent operation of production and testing workflows.
3Productivity
If multiple polishing sections or cleaning sections are used, then substrate processing efficiency is improved, but device complexity increases
Solution Approach 1:
Multiple polishing sections and cleaning sections are designed with identical or similar functional capabilities. Each section can independently process both production substrates and test substrates, providing universal functionality that simplifies the control logic despite the increased number of sections.
Data Source
AI summary
A CMP apparatus includes a polishing unit 3, a cleaning unit 4, a load/unload unit 2, a transfer unit, and a control section 5 configured to control transfer of a substrate in the transfer unit. When the polishing unit includes a plurality of polishing sections, or the cleaning unit includes a plurality of cleaning sections, the control section 5 can set a test mode that operates the polishing section or the cleaning section for a test to some of the plurality of polishing sections, or some of the plurality of cleaning sections, causes a substrate to be transferred to the polishing section or the cleaning section to which the test mode is not set, and causes a test substrate different from the substrate to be transferred to the polishing section or the cleaning section to which the test mode is set.