CMP Cleaning Chamber Layout to Prevent Substrate Cross-Contamination
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Solution Overview
Problem
In semiconductor device manufacturing, chemical mechanical polishing (CMP) systems face issues with cross-contamination and reintroduction of contaminants on substrate handling surfaces, leading to adverse effects on device performance and yield due to residual polishing fluids and byproducts.
Innovation Solution
The implementation of an integrated cleaning system with a wet-in/dry-out substrate cleaning module, featuring a chamber with dedicated openings for substrate handlers to transfer substrates between wet and dry conditions, and the use of multiple cleaning modules for concurrent processing, including horizontal pre-clean and single substrate clean modules, to effectively remove contaminants and prevent re-introduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are transferred through shared openings in cleaning chambers, then substrate handling is simplified, but cross-contamination occurs between wet and dry substrates
Solution Approach 1:
The cleaning chamber is divided into separate wet and dry sections with dedicated openings for each. Wet substrates enter through a first opening in the wet section, and dry substrates exit through a second opening in the dry section. This segmentation prevents cross-contamination while maintaining simplified handling procedures.
Solution Approach 2:
The harmful element (contaminants from wet substrates) is extracted from the path of dry substrates by creating separate transfer paths. Wet substrates are cleaned and dried within the chamber, then exit through a different opening than where dry substrates enter, effectively removing the contamination source from the dry substrate pathway.
2Area of stationary object
If multiple cleaning modules are integrated in a single chamber, then manufacturing floor space is conserved, but contamination flow between modules increases
Solution Approach 1:
The integrated cleaning chamber is segmented into distinct wet and dry processing zones with separate openings for substrate entry and exit. This segmentation allows multiple cleaning modules to coexist in a compact space while preventing contamination flow between them through dedicated transfer paths.
Solution Approach 2:
The chamber structure acts as an intermediary barrier between wet and dry cleaning modules. By positioning the wet section and dry section with separate openings, the chamber housing serves as a mediator that prevents direct contamination flow while maintaining integrated operation.
3Productivity
If substrates remain in wet condition during transfer, then cleaning process is continuous, but reintroduction of contaminants to dried substrates occurs
Solution Approach 1:
The wet cleaning process is extracted and contained within a dedicated wet section of the chamber with its own opening. Dried substrates exit through a separate opening in the dry section, removing the risk of contaminant reintroduction while maintaining continuous processing throughput.
Solution Approach 2:
The cleaning process maintains continuity through integrated wet and dry sections operating in sequence within the same chamber. Substrates are continuously processed from wet cleaning to drying without external intervention, then exit through a contamination-free path that preserves their clean state.
Data Source
AI summary
Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems, and more particular, to modular polishing systems used in the manufacturing of semiconductor devices. In one embodiment, a polishing system includes a first portion having a plurality of polishing stations disposed therein, and a second portion coupled to the first portion, the second portion comprising a substrate cleaning system. The substrate cleaning system comprises a wet-in/dry-out substrate cleaning module comprising a chamber housing which defines a chamber volume. The polishing system further includes a substrate handler located in the second portion, where the substrate handler is positioned to transfer substrates to or from the wet-in/dry-out substrate cleaning module through one or more openings formed in one or more sidewalls of the chamber housing.