CMP Substrate Cleaning Head With Sweep Spray for Edge Residue Removal
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Solution Overview
Problem
Current substrate cleaning methods after a chemical mechanical planarization (CMP) process are inadequate in removing particles and residues, particularly from the edges of substrates, leading to reduced yield and reliability in semiconductor device fabrication.
Innovation Solution
The substrate cleaning equipment features a redesigned nozzle system with a swing body and multiple cleaning liquid supply structures that move along a sweep line on the substrate, combined with a buffing pad, to effectively spray and remove residues and particles by aligning the cleaning liquid flow with the substrate's rotation direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional cleaning methods (brush box scrubbing and megasonic tank immersion) are used, then the cleaning process is simple to implement, but particles and residues on the substrate are difficult to remove
Solution Approach 1:
The cleaning system employs dynamic motion of the swing body along a sweep line combined with substrate rotation, creating relative motion between the cleaning liquid spray and substrate surface. This dynamic approach enhances particle removal effectiveness compared to static cleaning methods.
Solution Approach 2:
The invention uses cleaning liquid supply structures that spray liquid onto the substrate surface during the cleaning process. The hydraulic action of the cleaning liquid, combined with the motion system, effectively removes particles and residues without requiring complex mechanical contact systems.
2Reliability
If cleaning liquid is sprayed onto the substrate, then particles and residues are effectively removed, but the complexity of the cleaning system increases
Solution Approach 1:
The cleaning liquid supply is divided into multiple nozzles distributed across the swing body, with each nozzle targeting specific regions of the substrate. This segmentation allows effective coverage of the entire substrate surface while maintaining manageable complexity in each individual nozzle component.
Solution Approach 2:
The swing body serves multiple functions: it supports the cleaning liquid supply structures, provides the sweeping motion for distribution, and positions the nozzles optimally relative to the rotating substrate. This multi-functionality reduces the need for separate components, managing system complexity.
3Area of stationary object
If the swing body moves along a sweep line on the substrate, then cleaning coverage is improved, but the device complexity increases
Solution Approach 1:
The swing body executes a sweeping motion along an arc path on the substrate surface, dynamically adjusting the cleaning liquid distribution across different regions. This dynamic motion pattern achieves comprehensive coverage without requiring complex multi-axis positioning systems.
Solution Approach 2:
The cleaning liquid supply structures are integrated with the swing body motion mechanism, combining the liquid delivery function with the positioning function in a single integrated assembly. This merging reduces the number of separate components and simplifies the overall system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the removal of particles and residues from the substrate edges, improving the yield and reliability of semiconductor device fabrication by ensuring thorough cleaning and reducing the risk of residue re-deposition.
Implementation Method 1
The first cleaning liquid supply structure is coupled to the swing body and sprays a first cleaning liquid onto the main surface of the substrate
Implementation Method 2
The second cleaning liquid supply structure sprays a second cleaning liquid onto the main surface of the substrate
Implementation Method 3
a rotation direction of the substrate is the same as a rotation direction of the buffing pad
Data Source
AI summary
Substrate cleaning equipment includes a substrate holder which supports a substrate, a swing body, a head, a first cleaning liquid supply structure, and a second cleaning liquid supply structure. The swing body moves along a sweep line on a main surface of the substrate. The head is coupled to the swing body and includes a pad attachment surface facing the substrate holder. The first cleaning liquid supply structure is coupled to the swing body and sprays a first cleaning liquid onto the main surface of the substrate. The second cleaning liquid supply structure sprays a second cleaning liquid onto the main surface of the substrate. A buffing pad is attached to the pad attachment surface.