CMP Pad Conditioner Fastening to Block Abrasive Debris
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The chemical mechanical polishing (CMP) process faces issues with wafer damage due to abrasive debris particles generated during the conditioning process, which can cause scratches and breaks in the wafer.
Innovation Solution
The use of magnetic screws to secure the conditioning disk onto the conditioning arm, combined with a blocking device that covers the gap between the magnetic screw and the screw hole, prevents debris particles from being dislodged and reduces their presence on the polishing pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional screws are used to secure the conditioning disk, then the disk can be firmly attached, but abrasive debris particles are generated and dislodged onto the polishing pad causing wafer damage
Solution Approach 1:
The harmful function of screw holes generating and releasing abrasive debris is extracted and eliminated by replacing conventional screws with magnetic screws that eliminate the need for screw holes in the conditioning disk, thereby removing the source of debris generation
Solution Approach 2:
Magnetic screws act as an intermediary mechanism that provides secure attachment without mechanical penetration, using magnetic field interaction instead of physical screw holes to achieve the same functional goal without the harmful byproduct of debris generation
2Reliability
If the conditioning disk is securely fastened to the conditioning arm, then stable operation is achieved, but debris particles from the fastening mechanism contaminate the polishing pad
Solution Approach 1:
The mechanical screw-and-hole fastening system is replaced with a magnetic field-based attachment system, substituting mechanical penetration and friction-based holding with magnetic attraction, thereby eliminating debris generation while maintaining secure attachment and operational stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively minimizes abrasive debris on the polishing pad, preventing wafer scratches and improving yield by maintaining a cleaner polishing surface.
Implementation Method 1
The use of magnetic screws to secure the conditioning disk onto the conditioning arm
Data Source
AI summary
The present disclosure provides an apparatus and a method for polishing a semiconductor substrate in semiconductor device manufacturing. The apparatus can include: a carrier configured to hold the substrate; a polishing pad configured to polish a first surface of the substrate; a chemical mechanical polishing (CMP) slurry delivery arm configured to dispense a CMP slurry onto the first surface of the substrate; and a pad conditioner configured to condition the polishing pad. In some embodiments, the pad conditioner can include: a conditioning disk configured to scratch the polishing pad; a conditioning arm configured to rotate the conditioning disk; a plurality of magnetic screws configured to secure the conditioning disk onto the conditioning arm and including a respective plurality of screw heads; and a plurality of blocking devices respectively positioned beneath the plurality of screw heads and configured to block debris particles from entering a respective plurality of screw holes.