Edge Grinding Machines TRIZ Cases

See how a transition surface with a unique profile smooths the contour line between faceted and

See how flipping and washing both PCB faces after sawing reduces rejection from detritus and da

See how dual-grinder automation replaces manual angle grinding to cut screen frame preparation

See how a roller-brush mechanism with adjustable limit discs and soft pressure blocks automates

A flywheel and counterbalance let one floor treating attachment switch oscillation speed and orbit size for efficient cleaning with less carpet wear.

Guided rail motion automates PCB edge deburring, cutting manual labor, shortening cycle time, and containing shavings for safer operation.

A lower cup collects and discharges wafer edge grinding residue around the full circumference, reducing contamination and chipping.

A single piezoelectric element, support member, and compression member simplify drive control while reducing tensile stress and damage risk.

A Gapi metric from front-end wafer measurements predicts in-plane distortion early, enabling tool tuning or polishing sort to improve yield.

Trimming the wafer bevel after bonding removes peel-prone adhesive, preventing whisker buildup in thinning tools and easing blade control.

Curved edge surfaces disperse sidewall electric fields in an electrostatic chuck, reducing charged particle attachment and abnormal discharge.

Periodic switching between immersion and non-immersion states cuts processing liquid use during long single-substrate treatment.

Crystal orientation data guides ultrasonic direction and frequency during wafer edge grinding to cut cleavage risk and improve yield.

Front-end wafer edge profile analysis generates Gapi metrics to predict distortion early, enabling wafer sorting and process-tool tuning.

A two-stage rough and fine dressing process cuts truing time while maintaining precise grooved grinding stone shapes for SiC wafer chamfering.

Microbubble water cleans polished substrates without tool contact, removing particles while preventing re-adhesion and reverse contamination.

New wafer edge parameters define the main-surface/chamfer boundary to prevent photoresist bursting, oxide delamination, and sensor misses.

Multiple polishing lanes and a central transport unit enable parallel substrate polishing, cutting transfer delays and raising throughput.

A learned model predicts wafer edge profiles and corrects polishing conditions to reach target shapes with less manual setup time.

Alternating the pressing member tilt keeps tape pressure uniform across substrate center and edge regions despite bending and speed variation.

Controlled roughness across the chamfered glass edge scatters incident light to prevent red discoloration while preserving aesthetics and impact resistance.

A contact sensor head and displacement sensor track wafer edge polishing amount despite the inclined, narrow surface, enabling precise endpoint control.

Height distribution and change-rate analysis detects foreign matter on a wafer chuck table before cutting, preventing damage and poor processing quality.

Controlled roughness across a curved glass chamfer scatters incident light to prevent red discoloration without sacrificing impact resistance.

Plasma pretreatment softens SiC wafer edges before grinding, improving shape accuracy while reducing grindstone wear and maintenance.

Front-end wafer geometry data is converted into a Gapi metric to predict distortion early, tune process tools, and reduce overlay errors.

Ring-blade trimming plus polishing pad finishing smooths wafer edges to reduce chipping, foreign matter adhesion, and film peeling.

A Gapi metric from front-end wafer measurements flags in-plane distortion risk early, enabling wafer sorting and process tuning before lithography.

A beveled mirror edge and non-overlapping holder protect the reflective element while expanding rearward view in a frameless rearview mirror.

An annular elastic member smooths contact irregularities in wafer polishing heads, delivering more uniform force and fewer non-contact regions.

Sensor feedback from height, pressure, and light reflection detects wafer orientation to prevent grinding the wrong surface.

A beveled electro-optic mirror edge removes bezel overlap to widen rearward view while keeping the reflective element protected.

An annular groove with a tapered bottom lets wafer grinding crush the remaining edge cleanly, preventing scrap buildup and drain blockage.

Automated abrasive gauge inserts deburr motor stator slots while checking slot dimensions, improving precision and manufacturing consistency.

IR alignment marks guide a stealth laser damage region before blade trimming, improving wafer edge precision and reducing peeling.

A bezel-free rearview mirror assembly protects the reflective element while improving driver visibility and meeting head impact safety limits.

A bezel-free mirror holder encloses the reflective element without front overlap, improving head-impact safety, compliance, and forward vision.

A tuned edge chamfer on gallium oxide substrates suppresses cleavage and scratches during polishing, conveyance, and handling.

Adaptive truer taper angles keep silicon wafer edge taper within range as wheel grooves wear, extending chamfering wheel life.

Infrared mark detection aligns a stealth laser to create an internal damage region, enabling precise wafer edge trimming with less peeling.

A pre-planarized ring chuck table holds wafers at a constant grinding distance, removing pre-measurement and shortening edge trimming time.

Active and hard abrasives form and remove carbides below graphitization temperature to grind single-crystal diamond with less damage.

Magnetic screws and blocking devices keep conditioning debris out of CMP screw gaps, reducing wafer scratches and pad contamination.

Opposite grinding-mark curvature on both wafer surfaces suppresses damage, improves thickness uniformity, and cuts follow-up flattening steps.

Ultrasonic blade trimming forms a wafer edge groove while correcting blade tip shape, reducing chipping and contamination before thin-wafer grinding.

An undersized rotary table stabilizes the substrate during buff cleaning while exposing the edge for thorough front and back edge cleaning.

Magnetic screws and blocking devices keep abrasive debris from CMP conditioning screw holes off the pad, reducing wafer scratches and breakage.

A bezel-free mirror assembly uses adhesive mounting and a rounded glass edge to widen rearward view and improve head-impact safety.

A two-stage mirror-surface chamfering sequence lowers notch polishing rate after double-side polishing to protect wafer notch roughness.

Integrated cutting, grinding, cleaning, and inspection remove tin dots and scratches while preserving flatness in large TFT-LCD glass substrates.

A laser-formed conical separation layer removes the wafer edge excess during thinning, preventing chipping, collisions, and polishing pad damage.

Distributed subsurface laser damage patterns enable thin crystalline wafer separation with lower kerf loss, less stress, and faster processing.

Reordering notch, edge, and surface polishing improves wafer flatness near the notch while preserving notch depth for later processing.

A bezel-free rearview mirror uses a flush reflective element and integrated camera to widen rearward view and support driver monitoring.

Alternating silicon-reactive slurry with deionized water during CMP removes bulk silicon while preventing overpolishing of thin layers.

Alternating silicon-reactive slurry with deionized water controls bulk silicon removal, improving polishing uniformity and preventing thin-layer damage.

A spring-loaded feed shoe applies coolant tangentially to the grinding wheel, overcoming air cushion and centrifugal loss at the machining zone.

A locator-guided abrasive tool restores worn airfoil edges to the desired contour faster, more repeatably, and without engine removal.

Magnetic base retention replaces screw fixing to hold impellers and turbines securely during tumbling, improving surface finish and setup speed.

Vertical container buffering replaces wide conveyor loops in optical lens processing, cutting layout space and easing access and maintenance.

Automated check operations capture lens machining state data, helping diagnose defects faster and reduce maintenance time without skilled staff.

A robotic manipulator and pneumatic shock absorber let moving panels be sanded continuously across complex contours without manual work.

Calibrated pin locking sets chamfering depth in fixed increments, enabling fast, precise adjustment during cutter rotation while reducing injury risk.

A horizontal distance sensor verifies the fixing member state and blocks turret rotation when barrel tank angle deviation causes unsafe detection.

A raised fence and guide-wheel holder keep hand grinders aligned on countertop edges, improving seam quality and repeatable edge dressing.