Microbubble Substrate Cleaning for Reverse Contamination Prevention
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Solution Overview
Problem
Conventional substrate cleaning methods that involve contact with cleaning tools are inefficient in removing foreign matters and can lead to reverse contamination, as the cleaning tools near the end of their lifespan may fail to effectively remove particles, and particles can re-adhere to the substrate.
Innovation Solution
A substrate processing apparatus and method using microbubble water to clean the substrate surface without direct contact, employing a cleaning holder and a microbubble-water module with injection nozzles to inject microbubble water onto the substrate, which can include an alkaline chemical liquid, ensuring thorough cleaning and preventing re-adhesion of particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a contact-type cleaning tool is used to clean the substrate, then the substrate surface can be cleaned, but foreign matters may not be removed sufficiently and reverse contamination may occur
Solution Approach 1:
The patent replaces the mechanical contact cleaning system with a non-contact microbubble cleaning system. Microbubbles are generated and applied to the substrate surface, where they attach to foreign matters and remove them without mechanical contact, thereby eliminating reverse contamination while maintaining cleaning effectiveness.
Solution Approach 2:
The patent introduces microbubbles as an intermediary between the cleaning system and the substrate. These microbubbles serve as a mediator that attaches to foreign matters on the substrate surface and removes them without direct contact between the cleaning tool and the substrate, preventing reverse contamination.
2Reliability
If a cleaning tool approaches the end of its service life, then it may fail to efficiently remove foreign matters, but replacing it increases maintenance cost and complexity
Solution Approach 1:
The patent replaces the mechanical cleaning tool with a microbubble generation system. The microbubbles are generated on-demand and applied to the substrate surface, providing consistent cleaning effectiveness without the degradation issues associated with aging mechanical tools, thereby eliminating maintenance requirements.
Solution Approach 2:
The patent changes the cleaning mechanism from mechanical contact to microbubble-based non-contact cleaning. By generating microbubbles with specific size and concentration parameters, the system achieves efficient foreign matter removal without the reliability degradation that occurs with aging mechanical cleaning tools.
3Manufacturing precision
If polishing is performed on the substrate peripheral portion, then unnecessary films are removed, but foreign matters such as polishing debris may adhere to the substrate
Solution Approach 1:
The patent introduces microbubbles as an intermediary cleaning agent that is applied during the polishing process. These microbubbles attach to polishing debris on the substrate surface and remove them without direct contact, preventing contamination while maintaining the quality improvements from polishing.
Solution Approach 2:
The patent replaces mechanical contact cleaning during polishing with a microbubble-based non-contact cleaning system. The microbubbles effectively remove polishing debris without the risk of mechanical tools generating additional contamination or damaging the polished surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The microbubble water maintains high cleaning ability throughout the process, effectively removing foreign matters without reverse contamination, ensuring a clean substrate surface and reducing defects.
Implementation Method 1
a microbubble-water module configured to inject microbubble water onto a surface of the substrate held by the cleaning holder to clean the surface of the substrate
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
The present invention relates to a substrate processing apparatus and a substrate processing method for cleaning a substrate after polishing. The substrate cleaning apparatus includes a cleaning apparatus (131) for cleaning a polished substrate. The cleaning apparatus (131) includes a microbubble-water module (90) for injecting microbubble water onto the surface of the substrate (W), held in a substrate cleaning holder (52), to clean a surface of the substrate (W). The microbubble-water module (90) includes an injection nozzle (91) for injecting the microbubble water onto a target region (TR), which is an elongated region extending from a center (Cr) to an outer peripheral portion (Ci) of the substrate (W), and a microbubble-water supply device (93) for supplying the microbubble water to the injection nozzle (91).