Substrate Cleaning Module With Undersized Rotary Table for Edge Access
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Solution Overview
Problem
Existing substrate cleaning devices face challenges in maintaining substrate position stability, leading to positional deviations and difficulties in effectively buff cleaning the surface, particularly when applying forces perpendicular to the substrate surface.
Innovation Solution
A cleaning module with a rotary table smaller than the substrate, a buff cleaning portion for surface cleaning, and an edge cleaning portion with rollers for edge cleaning, along with movement and control mechanisms to ensure stable and thorough cleaning without interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a roller contacts the side surface of the substrate to hold it, then the substrate can be positioned, but positional deviation occurs when force is applied perpendicular to the substrate surface
Solution Approach 1:
The cleaning device is divided into separate functional components: a rotary table for stable substrate support, a buff cleaning portion for surface cleaning, and an edge cleaning portion for edge cleaning. This segmentation allows each component to perform its function independently without interfering with substrate stability.
Solution Approach 2:
The rotary table acts as an intermediary between the substrate and the cleaning portions. It provides a stable rotating platform that supports the substrate from below, allowing cleaning forces to be applied without causing positional deviation, as the rotary table absorbs and distributes these forces.
2Manufacturing precision
If a buff cleaning portion contacts the substrate surface to clean it, then surface cleaning is achieved, but substrate positional deviation occurs
Solution Approach 1:
The cleaning device separates the buff cleaning function from the substrate support function. The buff cleaning portion contacts only the surface of the substrate for cleaning, while the rotary table supports the substrate from below, preventing positional deviation during the cleaning process.
Solution Approach 2:
The support mechanism transitions from side-surface contact (horizontal dimension) to bottom-surface contact (vertical dimension). The rotary table supports the substrate from the bottom, allowing the buff cleaning portion to apply forces in the vertical dimension without causing horizontal positional deviation.
3Ease of operation
If the rotary table diameter is smaller than the substrate diameter, then edge cleaning is enabled without interference, but support coverage is reduced
Solution Approach 1:
The cleaning device divides the cleaning function into two separate portions: a buff cleaning portion for the central surface area and an edge cleaning portion for the peripheral edge area. This segmentation allows the rotary table to be smaller than the substrate while still providing comprehensive cleaning coverage.
Solution Approach 2:
The edge cleaning portion operates in a different spatial dimension than the buff cleaning portion. It contacts the edge part of the substrate that extends beyond the rotary table, allowing edge cleaning to occur without interfering with the compact rotary table design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient buff cleaning of the substrate surface and edge cleaning without positional deviations, ensuring a strong pressing force and effective cleaning of both the front and back edges of the substrate.
Implementation Method 1
a rotary table configured to support a circular substrate and have a diameter smaller than a diameter of the substrate
Implementation Method 2
a buff cleaning portion configured to buff clean a front side of the substrate while contacting the front side of the substrate supported by the rotary table
Implementation Method 3
an edge cleaning portion configured to clean an edge part of the substrate while contacting the edge part of the substrate supported by the rotary table
Data Source
AI summary
To perform both buff cleaning of a substrate surface and cleaning of an edge part of the substrate, a cleaning module includes: a rotary table configured to support a circular substrate and have a diameter smaller than a diameter of the substrate; a buff cleaning portion configured to buff clean a front side of the substrate while contacting the front side of the substrate supported by the rotary table; a buff cleaning portion movement mechanism configured to move the buff cleaning portion with respect to the substrate; a buff cleaning portion control mechanism configured to control an operation of the buff cleaning portion movement mechanism; and an edge cleaning portion configured to clean an edge part of the substrate while contacting the edge part of the substrate supported by the rotary table.