Tilting Processing Head for Uniform Substrate Tape Finishing
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Solution Overview
Problem
Existing substrate processing apparatuses face issues with non-uniform processing due to varying revolution rates and bending of substrates, leading to uneven application of processing tapes, particularly at the central and edge regions.
Innovation Solution
A substrate processing method involving a processing head with a tilting actuator that adjusts the angle of the pressing member to ensure uniform application of the processing tape across the substrate surface, including central, inner intermediate, outer intermediate, and edge portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate is processed while the pressing members and the substrate make circular motion relative to each other, then the entire substrate can be efficiently processed, but the pressing member in contact with the central region has relatively larger number of revolutions than other regions, causing non-uniform processing
Solution Approach 1:
The pressing member is made tiltable relative to the substrate surface, allowing dynamic adjustment of the contact angle during circular motion processing. This enables the pressing member to adapt its orientation to compensate for the varying revolution rates across different regions of the substrate, maintaining uniform processing pressure and achieving both high productivity and processing uniformity
2Area of stationary object
If the processing tape is pressed against the edge of the substrate by the pressing member, then the edge region can be processed, but the substrate bends upward, causing non-uniform pressing and non-uniform processing rate
Solution Approach 1:
The pressing member is equipped with a tilting mechanism that allows it to dynamically adjust its angle relative to the substrate surface. When processing the edge regions where substrate bending occurs, the pressing member can tilt to follow the bent surface, maintaining consistent contact pressure and ensuring uniform processing across the entire substrate area including edges
Data Source
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AI summary
The present invention relates to a substrate processing method of processing a substrate. The substrate processing method includes: rotating a substrate (W) about its own axis; and processing a surface (5a) of the substrate (W) by pressing a processing tape (2A) against the surface (5a) by a pressing member (12) of a processing head (10A) while the pressing member (12) is tilted in a first direction (D1) with respect to a predetermined pressing direction (CL) and the processing tape (2A) is fed in a longitudinal direction thereof, and then pressing the processing tape (2A) against the surface (5a) by the pressing member (12) while the pressing member (12) is tilted in a second direction (D2) opposite to the first direction (D1) with respect to the pressing direction (CL) and the processing tape (2A) is fed in the longitudinal direction thereof. The first direction (D1) and the second direction (D2) are directions along the longitudinal direction of the processing tape (2A) on the pressing member (12).