CMP Conditioner with Dilution Injector and Sonicator
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Solution Overview
Problem
Chemical mechanical polishing (CMP) processes generate byproducts that coagulate into large particles, which can scratch semiconductor substrates when they infiltrate the polishing head, causing damage.
Innovation Solution
A conditioner with a conditioning arm, a semi-ring shaped dilution solution injector, and a sonicator is integrated into the CMP apparatus to inject a dilution solution and apply ultrasonic waves to prevent coagulation and debris infiltration, featuring a semi-ring shaped dilution solution injector and sonicator positioned on opposite sides of the conditioning arm to manage debris effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conditioning disk contacts the polishing pad to condition it, then polishing pad conditioning is improved, but byproducts are generated that can coagulate and scratch the substrate
Solution Approach 1:
The harmful byproducts generated during conditioning are extracted from the slurry using a dedicated debris removal unit. This unit separates the byproducts from the polishing slurry before they can coagulate and cause substrate scratches, while maintaining the effectiveness of the conditioning process.
Solution Approach 2:
A debris removal unit acts as an intermediary between the conditioning disk and the substrate. This intermediate component captures and removes harmful byproducts generated during conditioning, preventing them from reaching and scratching the substrate while allowing the conditioning function to proceed.
2Productivity
If slurry is used for chemical mechanical polishing, then polishing function is improved, but ions in the slurry cause byproduct coagulation forming large particles
Solution Approach 1:
The debris removal unit extracts coagulated byproducts from the slurry, removing the harmful effect of large particle formation while preserving the polishing functionality of the slurry.
Solution Approach 2:
The system changes the physical state or properties of the slurry by introducing the debris removal mechanism, which alters how byproducts behave in the slurry - preventing coagulation into large particles that could scratch the substrate.
3Reliability
If byproducts infiltrate into the polishing head, then substrate damage occurs through scratches
Solution Approach 1:
The debris removal unit serves as a protective intermediary between the conditioning process and the polishing head. It intercepts and removes byproducts before they can infiltrate the polishing head and cause substrate scratches.
Solution Approach 2:
The system applies preliminary anti-action by proactively removing byproducts before they can cause harm. The debris removal unit is positioned to capture particles before they could potentially infiltrate the polishing head and scratch the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents substrate damage by suppressing coagulation and infiltration of debris through dilution and ultrasonic treatment, ensuring effective polishing without substrate scratches.
Implementation Method 1
a dilution solution injector on a first side of the conditioning arm and configured to inject a dilution solution to the slurry introduced into a space under the conditioning disk
Implementation Method 2
a sonicator on a second side of the conditioning arm and configured to apply an ultrasonic wave to debris generated from the polishing pad
Data Source
AI summary
Provided is a conditioner including a conditioning arm on a polishing pad that is configured to chemically mechanically polish a substrate based on slurry, a conditioning disk on the conditioning arm that is configured to condition the polishing pad, a dilution solution injector on a first side of the conditioning arm and configured to inject a dilution solution to the slurry introduced into a space under the conditioning disk, and a sonicator on a second side of the conditioning arm and configured to apply an ultrasonic wave to debris generated from the polishing pad.