CMP Conditioner Disk Detection for Uniform Polishing Pad Wear

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The issue of uneven wearing of the CMP polishing pad occurs due to the conditioner disk detaching from the holder or the conditioner arm moving to incorrect positions during the conditioning process, leading to degradation in polishing quality.

Innovation Solution

A polishing pad conditioner position detection module is introduced, which includes a detector to ensure the disk is correctly mounted and aligned on the holder, and the conditioner arm is in the right position, using a housing and detection part to verify the disk's position relative to the cleaning module.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the conditioner disk is mounted on the holder without position detection, then the conditioning process can proceed, but uneven wearing occurs on the polishing pad due to disk detachment or misalignment

Engineering Contradiction:
Improveconditioning process continuityVSAvoidpolishing pad uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The detector checks the disk position and mounting status before the conditioning process begins. This preliminary detection prevents uneven wearing by ensuring the disk is correctly positioned on the holder before operation starts, eliminating the need for repositioning or corrective actions during the conditioning process.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The detector provides real-time feedback on the disk's mounting status and position. When the disk is detected to be incorrectly positioned or detached, the system can alert operators or automatically adjust the position, ensuring continuous uniform conditioning of the polishing pad throughout the operation.

Inventive Principle:
Principle #23Feedback

2Manufacturing precision

If a detector is added to detect disk position and mounting status, then positioning accuracy is improved, but device complexity increases

Engineering Contradiction:
Improvedisk positioning accuracyVSAvoiddetection system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent replaces complex mechanical position verification methods with a detector-based system. Instead of using multiple mechanical sensors, switches, or manual verification procedures, a single detector (such as a photoelectric or capacitive sensor) is used to detect the disk's presence and position, simplifying the overall system while maintaining high positioning accuracy.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The detector serves multiple functions simultaneously: it detects whether the disk is mounted on the holder, verifies the disk's position, and can potentially trigger alerts or adjustments. This multi-functionality reduces the need for separate detection mechanisms for each parameter, thereby reducing overall device complexity while achieving comprehensive position monitoring.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250282023A1Polishing pad conditioner position detection module, polishing device, and polishing detection method using the position detection module
Publication Date: 2025.09.11 SAMSUNG ELECTRONICS CO LTD
  • US20250282023A1 patent drawing
  • US20250282023A1 patent drawing
  • US20250282023A1 patent drawing

AI summary

A polishing device includes a rotatable platen; a polishing pad placed on an upper surface of the platen and having a polishing surface; a polishing head disposed above the polishing pad and configured for mounting a substrate on a bottom surface of the polishing head; a driver configured to rotate the platen with respect to an axis perpendicular to the polishing surface of the polishing pad; a slurry supply outlet configured to supply slurry to the polishing surface of the polishing pad; a polishing pad conditioner for conditioning the polishing surface of the polishing pad; and a polishing pad conditioner position detection module configured to detect whether a disk of the polishing pad conditioner is correctly aligned.