Lapping Machines TRIZ Cases
- Modular Gas Pallet Assemblies for Compact CMP Cleaning Units
Modular gas pallets fit beneath CMP cleaning modules, easing service and expansion while limiting substrate air exposure and contamination risk.
- Polishing Pad Dressing Control With Load-Corrected Height Profiles
Load-induced compression can distort pad-height measurements; corrected radial profiles guide dresser speed for uniform polishing.
- CMP Control With Potentiostat Monitoring and Piezoelectric Pulsed Force
Conventional CMP struggles to balance force control and electrochemical measurement; this approach combines pulsed piezoelectric force with slurry monitoring.
- Polishing Pad Dents for Stronger Adhesive Layer Bonding
Discontinuous dents let adhesive fill the rough bottom surface, creating mechanical interlocking that resists shear and delamination.
- Elastic Membrane Break-In Processing for Polishing Apparatus Utilization
A dedicated stage uses pressurized fluid and load measurement to verify membrane break-in before polishing installation, preserving apparatus utilization.
- CMP Conditioner Disk Detection for Uniform Polishing Pad Wear
A detector verifies conditioner disk mounting and alignment to prevent uneven CMP pad wear and preserve pad thickness quality.
- Inline CMP Slurry Mixing With Real-Time Removal-Rate Feedback
Removal-rate sensing compares polishing results with a reference and adjusts base-slurry and additive flow rates during CMP.
- Horizontal Ultrasonic Cleaning Module for Slurry Residue Removal
A horizontal ultrasonic tank cleans downward-facing substrates while a transfer machine keeps guide rollers out of the cleaning area.