Polishing Pad Dents for Stronger Adhesive Layer Bonding

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Solution Overview

Problem

The stability of polishing pads is compromised due to adhesive layer deterioration from slurry debris, heat, and mechanical friction during the polishing process, leading to potential delamination.

Innovation Solution

The polishing pad features a polishing layer with discontinuous dents on its bottom surface, enhancing adhesive force by filling an adhesive layer into these dents, which improves stability and resistance to shear forces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive layers are used to adhere polishing layer to base layer, then bonding between layers is achieved, but adhesive layers deteriorate under slurry, heat, and friction causing delamination

Engineering Contradiction:

Improveadhesive bonding strengthVSAvoidadhesive layer stability

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent creates dents on the surface of the base layer before applying the adhesive layer. This preliminary action increases the surface area and provides mechanical interlocking features that enhance bonding strength and resistance to delamination under operational conditions

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces localized structural features (dents) at the interface between the base layer and adhesive layer. These dents create regions of increased adhesion strength precisely where bonding is most critical, while leaving other regions of the structure unchanged

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If polishing process is performed with slurry and friction, then surface planarization is achieved, but adhesive layers deteriorate and delamination occurs

Engineering Contradiction:

Improvesurface planarizationVSAvoidpolishing pad layer stability

Core Design Contradiction:

Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The dents are formed on the base layer surface before adhesive application, creating a pre-engineered structure that anticipates and resists the delamination forces generated during the polishing process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent creates a composite structure at the interface between base layer and adhesive layer through the dents, combining mechanical interlocking with adhesive bonding to produce a more robust connection that withstands polishing conditions

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The enhanced adhesive holding force and anti-shear characteristics of the polishing pad result in improved stability and extended maintenance time during polishing processes.

Implementation Method 1

The adhesive layer is adhered to the rough bottom surface... the adhesive layer filled into the discontinuous dents... the adhesive force and the adhesive holding force between the adhesive layer and the polishing layer are enhanced

Methodology Applied

Scientific EffectMechanical interlocking:

Data Source

PatentUS12420375B2Polishing pad and polishing method

Publication Date: 2025.09.23 IV TECH CO LTD

AI summary

A polishing pad adapted for polishing an object and having a polishing track region is provided. The polishing pad includes a polishing layer and an adhesive layer. The polishing layer has a polishing surface and a rough bottom surface opposite to each other, and the rough bottom surface includes a plurality of discontinuous dents. The adhesive layer is adhered to the rough bottom surface.