Inline CMP Slurry Mixing With Real-Time Removal-Rate Feedback

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Solution Overview

Problem

Existing CMP processes face challenges with inefficient and time-consuming slurry mixing methods, particularly in inline mixing approaches, which struggle to provide mixed slurries precisely and automatically to CMP platens, leading to suboptimal semiconductor wafer polishing results.

Innovation Solution

An inline CMP slurry mixing system that includes a mixing device with a container, blender, and sensors to detect instant removal rates, a signal processor to compare these rates with reference values, and a process controller to adjust slurry and additive flow rates in real time, ensuring precise and efficient slurry mixture delivery to the CMP platen.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If pre-mixing approach is used at vendor sites, then slurry evaluation can be performed, but it is time-consuming and cost-consuming due to multiple slurry evaluations, shipments, and on-site evaluations

Engineering Contradiction:

Improveslurry evaluation accuracyVSAvoidslurry evaluation time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The system performs preliminary slurry mixing and evaluation preparation at the vendor site before shipment. The inline mixing system is pre-configured with base slurry and additive components, allowing evaluation to begin immediately upon arrival without requiring time-consuming on-site mixing setup and multiple evaluation cycles.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces manual pre-mixing and evaluation processes with an automated inline mixing system that uses sensors and feedback control to automatically adjust slurry composition during the polishing process, eliminating the need for multiple manual evaluation cycles.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If inline mixing approach is used, then slurry mixing is faster and more efficient, but it struggles to provide mixed slurries precisely and automatically to CMP platens

Engineering Contradiction:

Improveslurry mixing efficiencyVSAvoidslurry delivery precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The inline mixing system incorporates sensors that continuously monitor slurry properties and provide feedback to the control system. This feedback mechanism enables real-time adjustments to additive dosing and mixing parameters, ensuring precise slurry composition and automatic delivery to the CMP platen while maintaining high mixing efficiency.

Inventive Principle:

Principle #23Feedback

Solution Approach 2:

The system uses dynamic control mechanisms that automatically adjust mixing ratios and flow rates based on real-time process conditions. The additive dosing system dynamically responds to sensor inputs to maintain precise slurry composition throughout the polishing process, combining speed with accuracy.

Inventive Principle:

Principle #15Dynamics

3Ease of manufacture

If traditional slurry mixing methods are used, then setup is simpler, but they lead to suboptimal semiconductor wafer polishing results

Engineering Contradiction:

Improvemixing system setup simplicityVSAvoidwafer polishing quality

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The inline mixing system is designed to be self-regulating with automatic control mechanisms that adjust slurry composition based on sensor feedback. Once installed, the system autonomously optimizes mixing parameters and maintains precise slurry delivery without requiring complex manual intervention, thereby achieving high wafer polishing quality while keeping operationally simple.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system enables real-time adjustment of slurry components, reducing evaluation time and improving CMP process effectiveness by achieving consistent and desired removal rates and dishing depths, thereby enhancing semiconductor wafer quality.

Implementation Method 1

a blender to mix the base slurry and the additives into a slurry mixture

Methodology Applied

Scientific EffectMechanical agitation: Stirring

Implementation Method 2

a removal rate sensor to detect an instant removal rate of the CMP platen

Methodology Applied

Scientific EffectMaterial removal detection:

Data Source

PatentUS20250289093A1System and method for real time inline mixing CMP slurry

Publication Date: 2025.09.18 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An inline CMP slurry mixing system includes a mixing device having a container and a blender, a removal rate sensor disposed adjacent to a CMP platen, a signal processor, and a process controller. The container is in fluid connection to a base slurry supply and additive supplies. The blender mixes a base slurry and multiple additives into a slurry mixture to be dispensed to the CMP platen. The removal rate sensor detects an instant removal rate of the CMP platen on a substrate. The signal processor compares the instant removal rate with a reference removal rate, and then determines whether to adjust one or more of flow rates of the base slurry and the additives based on the comparing. The process controller adjusts one or more of the flow rates of the base slurry and the additives based on the determining by the signal processor.