Horizontal Ultrasonic Cleaning Module for Slurry Residue Removal
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Solution Overview
Problem
Existing substrate cleaning methods, such as injecting cleaning liquid onto both surfaces of a substrate being transferred by a roller conveyor, fail to sufficiently remove residues like slurry, and immersing the substrate in a cleaning tank with a vertical posture can lead to re-adhesion of residues and complicate the apparatus structure.
Innovation Solution
A cleaning module with a transfer machine that transfers substrates with the polished surface facing downward, using a guide roller to stabilize the substrate in a cleaning tank spaced apart from the transfer passage, and includes an ultrasonic cleaning tank for effective residue removal without changing the substrate's posture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a guide roller is brought into contact with an upper surface of the substrate to guide the substrate, then the substrate can be stably housed in the housing space of the transfer machine, but a left-uncleaned part is generated in the portion with which the guide roller is brought into contact during cleaning
Solution Approach 1:
The guide roller is extracted from the cleaning area by positioning it upstream before the cleaning tank. The substrate is guided by the roller, then transferred to the cleaning tank where the guide roller does not interfere with the cleaning process, eliminating left-uncleaned parts while maintaining positioning stability through the transfer mechanism
Solution Approach 2:
A transfer machine acts as an intermediary between the guide roller and the cleaning tank. It receives the substrate from the guide roller, positions it correctly, and transfers it to the cleaning tank, allowing the guide roller to perform its guiding function without contaminating the cleaning process
2Manufacturing precision
If the substrate is immersed in a cleaning liquid in a vertical posture for ultrasonic cleaning, then cleaning capability is improved, but the apparatus structure becomes complicated and residues may re-adhere to the substrate
Solution Approach 1:
Instead of changing the substrate posture to vertical for cleaning, the cleaning tank and substrate are positioned horizontally. The guide roller is placed upstream and the transfer machine handles the substrate transfer, eliminating the need for posture change mechanisms while preventing residue re-adhesion through proper positioning
Solution Approach 2:
The posture change function is extracted from the cleaning process. The substrate maintains its horizontal posture throughout cleaning, and the transfer machine handles all positioning and transfer operations, simplifying the apparatus structure while maintaining cleaning effectiveness through ultrasonic waves in horizontal position
3Productivity
If cleaning liquid is injected onto both surfaces of the substrate being transferred by roller conveyor, then the substrate is cleaned during transfer, but residue such as slurry is not sufficiently removed
Solution Approach 1:
The transfer machine serves as an intermediary that separates the guiding function (guide roller) from the cleaning function (cleaning tank). It transfers the substrate from the guide roller to the cleaning tank where thorough cleaning occurs, ensuring complete residue removal while maintaining efficient throughput
Solution Approach 2:
The cleaning process is segmented into distinct stages: guidance by the guide roller, transfer by the transfer machine, and thorough cleaning in the cleaning tank. This segmentation allows each component to perform its function optimally, ensuring complete residue removal while maintaining productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable substrate guidance, reduces residue re-adhesion, and enhances cleaning capability with a simple apparatus structure by maintaining the substrate's orientation during cleaning.
Implementation Method 1
irradiating both surfaces of the substrate with ultrasonic waves
Data Source
AI summary
To achieve a cleaning module and a substrate processing apparatus that can improve the cleaning capability for a substrate with a simple structure.A cleaning module includes a first transfer mechanism 210-1, an ultrasonic cleaning tank 440, a transfer machine 420, and a second transfer mechanism 210-2. The first transfer mechanism 210-1 is for transferring a substrate WF with a surface to be polished facing downward up to a substrate grip or release position 418 on a downstream side along a transfer passage 405. The ultrasonic cleaning tank 440 is disposed at a position spaced apart from the transfer passage 405 and is for cleaning a substrate WF with the surface to be polished facing downward. The transfer machine 420 is for transferring the substrate WF between the substrate grip or release position 418 of the transfer passage 405 and the ultrasonic cleaning tank 440. The second transfer mechanism 210-2 is for transferring the substrate WF transferred to the substrate grip or release position 418 from the ultrasonic cleaning tank 440 by the transfer machine 420 to further downstream along the transfer passage 405.