In-Situ Conditioner Disk Cleaning for CMP Corrosion Control

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Solution Overview

Problem

Conventional conditioner disks in chemical mechanical polishing (CMP) systems face issues such as corrosion and reduced lifetime due to exposure to polishing slurry, leading to potential substrate defects and lower throughput, especially during in-situ conditioning processes.

Innovation Solution

Incorporating a cleaning station adjacent to the polishing pad to clean the conditioner disk during polishing operations, using a brush and fluid nozzles to remove slurry and debris, thereby reducing corrosion and extending disk life while maintaining high throughput.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the conditioner disk is used for in-situ conditioning during polishing, then the polishing throughput is improved, but the conditioner disk corrosion increases and lifetime decreases

Engineering Contradiction:

Improvepolishing throughputVSAvoidconditioner disk lifetime

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The conditioner disk is cleaned in advance during idle periods between substrate polishing operations. The cleaning station removes slurry and debris from the conditioner disk surface before the next conditioning operation, preventing corrosion accumulation while maintaining continuous polishing throughput.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The conditioner disk undergoes periodic cleaning cycles during the polishing process. The system alternates between conditioning operations (when substrate is being polished) and cleaning operations (during idle periods), creating a periodic pattern that maintains disk reliability without sacrificing overall productivity.

Inventive Principle:

Principle #19Periodic action

2Reliability

If the conditioner disk is cleaned separately after polishing, then the corrosion is reduced, but the polishing throughput decreases

Engineering Contradiction:

Improveconditioner disk corrosion resistanceVSAvoidpolishing throughput

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The cleaning function is merged with the existing polishing station by integrating a cleaning station adjacent to the platen. The conditioner disk is cleaned in-situ during idle periods between polishing operations, combining the cleaning function with the polishing process without requiring separate cleaning equipment or time.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conditioner disk is cleaned automatically during the polishing process itself, using the idle periods when no substrate is being polished. The system serves its own maintenance needs by utilizing its own operational cycles for cleaning, eliminating the need for external cleaning operations.

Inventive Principle:

Principle #25Self-service

3Productivity

If slurry and debris accumulate on the conditioner disk, then the polishing continuity is maintained, but the substrate defect risk increases

Engineering Contradiction:

Improvepolishing continuityVSAvoidsubstrate defect risk

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The system rapidly removes slurry and debris from the conditioner disk surface during idle periods using a brush and fluid spray. The cleaning action rushes through the removal of contaminants before they can cause substrate defects, maintaining polishing continuity by quickly resetting the conditioner disk for the next operation.

Inventive Principle:

Principle #21Skipping (Rushing through)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces conditioner disk corrosion and extends its lifespan, minimizing substrate defects and maintaining efficient polishing throughput by integrating in-situ cleaning, thus enhancing the overall CMP process efficiency.

Implementation Method 1

using a brush and fluid nozzles to remove slurry and debris

Methodology Applied

Scientific EffectFriction: Friction

Implementation Method 2

a conditioner head to hold a conditioner disk against the polishing pad... Contact and motion of the abrasive surface against the polishing pad roughens the polishing surface

Methodology Applied

Scientific EffectAbrasion: Abrasion

Implementation Method 3

using a brush and fluid nozzles to remove slurry and debris

Methodology Applied

Scientific EffectFluid spray: Fluid Spray

Data Source

PatentUS12459078B2In-situ conditioner disk cleaning during CMP

Publication Date: 2025.11.04 APPLIED MATERIALS INC

AI summary

A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.