CMP Composition Cyclodextrin Alkylamine Complex Planarization
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Solution Overview
Problem
Current chemical-mechanical planarization (CMP) processes for dielectric substrates face challenges in achieving high planarization efficiency without reducing the active removal rate, particularly in 3D NAND applications where large initial step heights require high removal rates, and previous additives often lead to undesirable reductions in removal rates or process instability.
Innovation Solution
A CMP composition comprising cyclodextrin and alkylamine, which form a complex to enhance planarization efficiency while maintaining high dielectric removal rates, is used in conjunction with ceria-based abrasive particles, allowing for reduced alkylamine levels to achieve desired improvements without substantial reductions in removal rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If alkylamine is added to CMP composition to improve planarization efficiency, then planarization efficiency is improved, but removal rate is reduced
Solution Approach 1:
Cyclodextrin acts as an intermediary substance that forms a complex with alkylamine, modifying its chemical behavior. This complex allows the alkylamine to improve planarization efficiency by reducing trench loss while preventing the excessive reduction of removal rate that occurs with free alkylamine, thus mediating between the two conflicting requirements
Solution Approach 2:
The invention changes the chemical state of alkylamine from free form to complexed form with cyclodextrin. This parameter change in the chemical form of the additive modifies its interaction with the dielectric material and substrate, enabling improved planarization efficiency without the severe penalty to removal rate observed with conventional alkylamine addition
2Manufacturing precision
If alkylamine level is increased to improve planarization efficiency, then planarization efficiency is improved, but process stability deteriorates
Solution Approach 1:
Cyclodextrin serves as a stabilizing intermediary that complexes with alkylamine, preventing the process instability that occurs at higher alkylamine concentrations. This complexation controls the release and interaction of alkylamine with the substrate, maintaining process stability while still achieving improved planarization efficiency
Solution Approach 2:
The cyclodextrin-alkylamine complex provides beforehand cushioning by pre-controlling the chemical activity of alkylamine. This prevents excessive reactions or instabilities that would occur with high levels of free alkylamine, cushioning the process against instability while maintaining the beneficial effects on planarization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cyclodextrin-alkylamine complex in the CMP composition improves planarization efficiency by reducing trench loss and maintaining high removal rates, even at larger substrate sizes, such as 300 mm wafers, making it suitable for high-throughput processing in 3D NAND applications.
Implementation Method 1
the composition contains cyclodextrin and alkylamine... the cyclodextrin-alkylamine complex in the CMP composition improves planarization efficiency
Data Source
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AI summary
Described are compositions useful in methods for chemical-mechanical processing a surface of a substrate, especially a substrate that contains dielectric material, wherein the composition contains cyclodextrin and alkylamine.