Dual-Temperature Slurry Dispensing for CMP Pad Thermal Control
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Solution Overview
Problem
Existing chemical mechanical polishing (CMP) apparatuses face challenges in maintaining a consistent pad temperature, leading to defects such as corrosion and dishing effects, as they rely on a single chemical slurry with temperature adjustments, which can cause delays and inefficiencies.
Innovation Solution
A CMP apparatus that concurrently dispenses two polishing slurries at different temperatures, with flow rates adjusted based on real-time pad temperature monitoring to maintain a constant temperature, using a first slurry at a higher temperature and a second slurry at a lower temperature to control the pad temperature dynamically.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pad temperature is increased to increase polishing rate and throughput, then productivity is improved, but manufacturing precision deteriorates due to corrosion and dishing defects
Solution Approach 1:
The patent applies parameter changes by dynamically adjusting the temperature of the chemical slurry based on real-time pad temperature monitoring. The system changes the slurry temperature parameter to compensate for pad temperature variations, thereby maintaining optimal polishing conditions and preventing defects while preserving high polishing rates.
2Manufacturing precision
If the pad temperature is decreased to prevent corrosion and dishing defects, then manufacturing precision is improved, but productivity deteriorates due to reduced polishing rate
Solution Approach 1:
The system dynamically adjusts the chemical slurry temperature parameter in response to pad temperature changes. When pad temperature decreases, the slurry temperature is increased to maintain optimal polishing chemistry and rate, thereby preventing productivity loss while maintaining surface quality.
3Device complexity
If a single chemical slurry temperature is adjusted to maintain pad temperature, then device complexity is reduced, but reliability deteriorates due to temperature control delays causing defects
Solution Approach 1:
The patent implements feedback control by continuously monitoring pad temperature and using this information to adjust the chemical slurry temperature. This closed-loop feedback system responds dynamically to temperature changes, eliminating delays and preventing defects while maintaining a relatively simple single-slurry delivery system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise and responsive maintenance of a constant pad temperature, reducing defects and improving the CMP process efficiency by dynamically adjusting the flow rates of the slurries to maintain optimal polishing conditions.
Implementation Method 1
a first polishing slurry that is maintained at a first temperature and a second polishing slurry that is maintained at a second temperature are concurrently dispensed, but at respective different flow rates, onto a polishing pad
Data Source
AI summary
An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.