Lapping Machines TRIZ Cases

Asymmetric bell-shaped abrasive composites maintain consistent load-bearing area during erosion, extending useful life beyond conventional pyramidal products.

External laser components heat slider transducers to protrude write poles and readers toward the lapping surface.

Regulating gas flow rates via dedicated valves inflates the elastic membrane precisely, preventing excessive stress on wafers during release.

A hydrophobic coating on a substrate exterior surface maintains water contact angles above 100 degrees after abrasion testing.

Displacement sensors measure horizontal plate height positions to calculate upper turn table relative height and eccentric angle.

Dynamic nozzle positioning corrects non-uniform flow rates, ensuring consistent material removal during chemical mechanical planarization.

Eddy current sensor impedance coordinates define an arc trajectory to isolate substrate resistivity interference and pad wear distance variations.

A temperature control system sprays aerosolized coolant directly onto a polishing pad to manage the substrate surface.

Imaging device generates moire pattern from wafer lattice to determine pitch and detect polishing end point without high-magnification microscopy.

A rotary joint uses a link mechanism with spherical plain bearings to constrain rotation and absorb stick-slip vibrations.

A polishing head elastic membrane uses a vaulted shape to press the retainer ring against the polishing pad.

High-pressure water injection cleans the rotating dresser surface, preventing debris accumulation that reduces polishing efficiency.

A light transmitting member uses a screw thread for detachable attachment to a polishing pad.

A flushing device clears processing liquid supply lines using a dedicated cleaning liquid and switching valve.

Cleaning removes cerium oxide residue before silica polishing to prevent abrasive aggregation.

Separating the swing arm from the rotating table removes noise interference, enabling precise polishing end point detection based on measured torque.

Weight measurement in the relay block determines removal amounts within permissible ranges, resolving precision and complexity trade-offs.

A laser-based conditioning device emits a beam toward a polishing surface to achieve uniform roughness, eliminating debris generation from mechanical abrasion.

Sequential polishing with metal liquid and deionized water reduces gate electrode residue on interlayer dielectric layers, improving device performance.

Normalize in-situ optical spectra using a pre-deposition base spectrum to filter noise from underlayer variations and determine the precise polishing endpoint.

Raising the retainer ring above the workpiece before lifting prevents bending and stress caused by worn ring surfaces.

Lapped coatings on degradable downhole tools resist corrosion during storage, enabling controlled degradation after deployment.

A fluid storage element buffers pressure to inflate a polishing head membrane for wafer release.

Diluting colloidal silica slurry with ammonia water prevents particle aggregation, maintaining dispersion quality and reducing haze levels on polished surfaces.

Ion implantation confined to the main flat portion eliminates chamfering and etching, reducing processing time and cost.