Substrate Processing Line Flushing to Prevent Particle Contamination
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Solution Overview
Problem
In substrate processing systems, the stagnation of processing liquids in pipes leads to concentration changes and particle condensation, causing adverse effects on wafer processing, including scratches and altered processing results.
Innovation Solution
A substrate processing system with a flushing device that uses a cleaning liquid to clear the processing-liquid supply line and distribution line, directing the liquid to a disposal area, and includes a particle measuring device to monitor and control particle levels, ensuring the processing liquid's original properties are maintained.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the processing liquid is supplied continuously through the distribution line and processing-liquid supply line, then the substrate processing can be performed without interruption, but the processing liquid stagnates in the pipes during idle periods, causing concentration changes and particle condensation
Solution Approach 1:
The system performs preliminary cleaning action by introducing cleaning liquid through the cleaning-liquid supply line before substrate processing begins or after processing ends. This preliminary action removes stagnated processing liquid and prevents concentration changes and particle condensation, ensuring the processing liquid maintains its original properties when actually used for substrate processing.
Solution Approach 2:
The cleaning liquid acts as an intermediary substance that flows through the distribution line and processing-liquid supply line to remove deteriorated processing liquid. The supply switching valve controls this intermediary cleaning liquid to flush the pipes, thereby restoring the quality of the processing liquid without requiring system disassembly or manual intervention.
2Loss of time
If the processing liquid is allowed to stagnate in the pipes during idle periods, then the system can remain ready for immediate processing, but the concentration distribution changes and coarse particles form, causing scratches on wafers
Solution Approach 1:
The system maintains continuous useful action by automatically introducing cleaning liquid through the cleaning-liquid supply line during idle periods. This continuous cleaning action prevents the processing liquid from stagnating and deteriorating, thereby preventing coarse particle formation that would cause wafer surface damage, while keeping the system ready for immediate processing.
Solution Approach 2:
The operation controller monitors the system state and provides feedback control by automatically activating the supply switching valve to introduce cleaning liquid when the substrate processing apparatus is idle. This feedback mechanism ensures that the processing liquid quality is maintained by preventing stagnation-related deterioration before it can affect wafer processing.
3Reliability
If a flushing device is added to clean the distribution line and processing-liquid supply line, then the processing liquid quality is maintained, but the device complexity increases with additional valves and piping
Solution Approach 1:
The cleaning-liquid supply line is designed to connect to the existing distribution line infrastructure at a suitable location, allowing the same piping network to serve dual purposes: distributing processing liquid during operation and receiving cleaning liquid for flushing during idle periods. The supply switching valve integrates into the existing valve system, enabling multi-functionality without requiring completely separate independent flushing infrastructure.
Data Source
AI summary
The present invention relates to a substrate processing system and a substrate processing method capable of cleaning a processing-liquid supply line. A substrate processing system includes: a substrate processing apparatus (1) configured to process a substrate W; and a flushing device for cleaning a distribution line (93) and a processing-liquid supply line (92). The flushing device includes: a cleaning-liquid supply line (99) coupled to the distribution line (93); a drain mechanism (101) configured to direct a cleaning liquid, supplied into the processing-liquid supply line (92) through the distribution line (93), to a liquid disposal area (100); a supply switching valve (104) configured to allow only the processing liquid or the cleaning liquid to flow in the distribution line (93); and an operation controller (30) configured to control operations of the drain mechanism (101) and the supply switching valve (104).