Polishing Apparatus Moire Pattern Pitch Detection
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Solution Overview
Problem
Polishing conditions for wafers with complex patterns are challenging due to varying geometric elements like pitch, leading to inaccurate film thickness estimation and polishing end point detection, especially with fine patterns where light interference occurs, making it difficult to optimize polishing without high-magnification microscopic systems.
Innovation Solution
A polishing apparatus with an imaging device and image analysis system that generates images of the wafer pattern, uses a lattice with a reference pattern to create a moire pattern, allowing for the determination of geometric elements like pitch without requiring high-magnification systems, and detects the polishing end point by analyzing the sharpness of the moire pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an optical polishing monitoring system is used to estimate film thickness based on reflected light spectrum, then polishing end point detection is enabled, but light interference due to fine patterns causes inaccurate film thickness estimation
Solution Approach 1:
The patent introduces a lattice as an intermediary object with a reference pattern that is superimposed on the wafer pattern. This lattice serves as a mediator that converts the fine, hard-to-detect wafer pattern into a moire pattern with larger, easily detectable features. The moire pattern acts as an intermediary representation that preserves the geometric information of the original pattern while being suitable for optical detection without interference issues.
Solution Approach 2:
The patent creates an optical copy of the wafer pattern through the lattice's reference pattern, generating a moire pattern that replicates the essential geometric characteristics (pitch, orientation) of the original pattern. This copied representation allows for accurate measurement of pattern geometry using simple optical means rather than requiring direct observation of the fine original pattern.
2Measurement precision
If a microscopic system with ultra-high magnification is used to directly observe pattern appearance, then polishing end point detection accuracy is improved, but device complexity and precision requirements increase significantly
Solution Approach 1:
The lattice serves as a simple intermediary device that transforms the observation task from direct high-magnification microscopy to low-magnification moire pattern observation. Instead of using a complex microscopic system to directly resolve fine pattern details, the lattice mediates by creating a magnified moire pattern that can be observed with simple optics, thereby achieving the same information gain without the complexity.
Solution Approach 2:
The patent transitions from direct spatial observation of fine patterns to observation in a different dimensional representation through moire interference. The moire pattern creates a new dimensional encoding of the original pattern geometry, where pitch and orientation information are represented in the spatial frequency domain of the interference pattern, allowing for easier measurement with simple optics.
3Manufacturing precision
If polishing conditions are optimized based on pattern geometric elements, then polishing load distribution and end point detection are improved, but geometric element detection becomes difficult without direct pattern observation
Solution Approach 1:
The lattice with reference pattern acts as a mediator that enables easy detection of geometric elements (pitch, orientation) by transforming them into moire pattern characteristics. The moire pattern's spatial frequency and orientation directly correspond to the wafer pattern's geometric elements, allowing for simple measurement and subsequent optimization of polishing conditions based on detected pattern geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate determination of geometric elements and polishing end points based on the appearance of the moire pattern, optimizing polishing conditions and eliminating the need for precise microscopic systems in dynamic environments.
Implementation Method 1
the image analysis system is configured to determine the geometric element of the pattern of the workpiece based on a moire pattern appearing on the image due to superimposition of the pattern of the workpiece and the reference pattern
Data Source
AI summary
The present invention relates to a polishing apparatus and a polishing method for polishing a workpiece, such as a wafer on which a pattern is formed, on a polishing pad, and more particularly, relates to a polishing apparatus and a polishing method for detecting a geometric element of a pattern, such as a pitch. The polishing apparatus includes: a polishing table (3) configured to support a polishing pad (2); a polishing head (1) configured to press a workpiece (W), having a pattern formed therein, against the polishing pad (2) and polish a surface of the workpiece (W), an imaging device (20) disposed in the polishing table (3) and configured to generate an image including at least the pattern of the workpiece (W), and an image analysis system (30) configured determining a geometric element of the pattern of the workpiece (W) based on the image.


