Resinous Carrier Contact Angle Control for Double-Side Polishing
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Solution Overview
Problem
Resinous carriers for double-side polishing apparatuses have a lower polishing rate and productivity compared to metallic carriers, with a 40% inferior polishing rate and reduced productivity for semiconductor silicon wafers.
Innovation Solution
A resinous carrier with a hydrophilic fibrous base material, having an average contact angle of 45° to 60° with pure water on its surfaces and a surface angle difference of 5° or less, is used between the upper and lower turn tables of a double-side polishing apparatus, enhancing the polishing rate and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a resinous carrier is used instead of a metallic carrier, then the carrier achieves light weight, low cost, and simple structure, but the polishing rate for semiconductor silicon wafers decreases by about 40%
Solution Approach 1:
The invention changes the surface property parameter of the resinous carrier by controlling its hydrophilicity. Specifically, the contact angle with pure water is adjusted to 40° or less, which fundamentally alters how the carrier interacts with the polishing pad and slurry. This parameter change enables the resinous carrier to achieve a polishing rate comparable to metallic carriers while maintaining its manufacturing advantages of light weight, low cost, and simple structure.
2Productivity
If the contact angle of the resinous carrier surface is reduced to 40° or less, then the polishing rate is significantly enhanced, but the surface treatment process becomes more critical
Solution Approach 1:
The invention establishes a specific parameter range for the contact angle (40° or less) that optimizes the interaction between the carrier, polishing pad, and slurry. By defining this critical parameter threshold, the invention provides clear manufacturing guidance while achieving the desired polishing rate enhancement.
Solution Approach 2:
The resinous carrier itself can be designed as a disposable or replaceable component. Rather than investing in complex, expensive surface treatment processes to achieve precise contact angles, the system uses relatively simple surface treatments on carriers that can be replaced if needed, reducing overall system cost and complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resinous carrier significantly enhances the polishing rate by 10% to 25% or more, doubling the productivity of double-side polished wafers compared to conventional resinous carriers, while maintaining ease of manufacturing with commonly used materials.
Implementation Method 1
an average contact angle with pure water of front and back surfaces of the carrier, which come into contact with the polishing pads, is 45° or more and 60° or less
Data Source
AI summary
A carrier for a double-side polishing apparatus configured to double-side polish providing a semiconductor silicon wafer. The carrier being disposed between upper and lower turn tables have a polishing pad attached, and includes a holding hole formed to hold the semiconductor silicon wafer between the upper and lower turn tables during polishing. The carrier for a double-side polishing apparatus is made of a resin. An average contact angle with pure water of front and back surfaces of the carrier, which come into contact with the polishing pads, is 45° or more and 60° or less, and a difference in average contact angles between the front surface and the back surface is 5° or less, which provides a carrier for a double-side polishing apparatus capable of enhancing the polishing rate for a semiconductor silicon wafer by using a resinous carrier; and a double-side polishing apparatus and method which employ the carrier.