CMP Polishing Pad Temperature Control via Heating-Fluid Nozzle

The patent introduces a heating fluid as an intermediary substance to transfer thermal energy to the polishing pad. Instead of direct contact between a temperature-regulating component and the pad, the heating fluid circulates through channels in the pad, delivering heat without causing contamination. This resolves the contradiction by enabling temperature regulation while eliminating the harmful direct contact that causes substrate contamination.

The patent replaces the mechanical contact-based temperature regulation system (pad contact member) with a fluid-based thermal transfer system. The heating fluid carries thermal energy through the polishing pad via convection and conduction, eliminating the need for mechanical contact components that would otherwise contaminate the substrate during polishing operations.

The patent segments the heating function into multiple independent channels distributed throughout the polishing pad. Each channel receives heating fluid from the circulation system, allowing localized temperature control. This segmentation enables even temperature distribution across the pad surface without requiring complex correction mechanisms, as each segment operates independently to maintain uniform thermal conditions.

The patent controls the temperature distribution by adjusting parameters of the heating fluid (temperature, flow rate) and the characteristics of the heating channels (diameter, length, distribution). By optimizing these parameters, the system achieves uniform temperature distribution across the polishing pad without needing complex mechanical correction mechanisms, thereby reducing device complexity while maintaining effective temperature regulation.