CMP Load Cup Nozzle Cleaning for Substrate Edge Residue
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing chemical mechanical polishing (CMP) systems face challenges in effectively removing residues from the substrate edge and gaps in the carrier head, leading to defects and reduced efficiency due to accumulated polishing slurry and organic residues.
Innovation Solution
The use of energized fluid nozzles, such as those expelling high-pressure steam or gas phase streams, to clean the substrate edges and gaps in the carrier head, combined with deionized water for temperature control, effectively dislodges residues without overheating the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning methods are used, then the structure is simple, but residues accumulate on substrate edges and in carrier head gaps causing defects
Solution Approach 1:
The cleaning system is segmented into multiple independent nozzle assemblies, each targeting specific areas (substrate edge, carrier head gap, membrane gap). This segmentation allows each nozzle to be optimized for its specific cleaning task while collectively providing comprehensive coverage, resolving the contradiction between thorough cleaning and system simplicity.
Solution Approach 2:
Energized fluid (steam or gas) acts as an intermediary medium to transmit cleaning energy to residues in hard-to-reach areas. The fluid delivers thermal and kinetic energy through narrow gaps without requiring direct mechanical contact, enabling effective cleaning of substrate edges and carrier head gaps while maintaining system simplicity.
2Reliability
If high-energy cleaning is applied to dislodge residues, then cleaning effectiveness improves, but substrate temperature increases causing potential damage
Solution Approach 1:
The cleaning system applies local quality by directing energized fluid selectively to specific areas (substrate edge, carrier head gap, membrane gap) rather than uniformly heating the entire substrate. The upward angle of the nozzles ensures energy is concentrated on residues and gap areas while minimizing thermal exposure to the substrate bulk, maintaining cleaning effectiveness while preventing overheating.
Solution Approach 2:
The cleaning process uses periodic action by alternating between energized fluid delivery and pause intervals, allowing the substrate to cool between energy applications. This periodic cycling prevents cumulative heat buildup while maintaining effective residue dislodgement through repeated thermal-kinetic pulses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures thorough cleaning of substrate edges and gaps, preventing defects and maintaining substrate integrity by dislodging residues efficiently while controlling substrate temperature.
Implementation Method 1
The use of energized fluid nozzles, such as those expelling high-pressure steam or gas phase streams
Implementation Method 2
expelling high-pressure steam or gas phase streams
Implementation Method 3
combined with deionized water for temperature control, effectively dislodges residues without overheating the substrate
Data Source
AI summary
The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.