CMP Oxidizer Delivery Segmentation for Chemical Stability

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Solution Overview

Problem

The existing chemical-mechanical planarization (CMP) processes face challenges with the instability of oxidizers like hydrogen peroxide and sodium hypochlorite, which degrade during transfer and react with other chemicals in the slurry, affecting the chemical stability and efficiency of the polishing process.

Innovation Solution

Introducing oxidizer materials, such as hydrogen peroxide and ozone, directly into the CMP apparatus along with a catalyst, where they generate radicals that react with the wafer surface, enhancing the polishing process while maintaining chemical stability by separating their introduction from the slurry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If oxidizer materials are added to the slurry in advance, then the CMP process can proceed, but the oxidizer degrades during transfer and loses chemical stability

Engineering Contradiction:
ImproveCMP process efficiencyVSAvoidchemical stability of oxidizer
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

The system separates the oxidizer delivery from the slurry system by using a dedicated oxidizer delivery pump and separate tubing. The oxidizer is delivered independently to the polishing pad rather than being mixed into the slurry in advance, preventing degradation while ensuring timely delivery for the CMP process.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The polishing pad acts as an intermediary where both slurry and oxidizer are delivered separately and then combined at the point of application. This allows the oxidizer to be introduced separately from the slurry, maintaining its chemical stability during transfer while still enabling the CMP reaction to occur effectively.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Stability of the object's composition

If oxidizer is introduced separately from slurry, then chemical stability is maintained, but the system complexity increases

Engineering Contradiction:
Improvechemical stability of oxidizerVSAvoidsystem complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The oxidizer delivery pump and tubing system are integrated into the existing CMP apparatus infrastructure, sharing the same control system and delivery mechanism principles as the slurry system. This multi-functional approach allows separate oxidizer delivery without proportionally increasing overall system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If oxidizer reacts with other chemicals in slurry, then CMP reaction occurs, but the slurry chemical stability is affected

Engineering Contradiction:
ImproveCMP reaction efficiencyVSAvoidslurry chemical stability
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

The oxidizer is delivered to the polishing pad simultaneously with or just before the slurry application, ensuring it is in position and ready to react with the wafer surface materials. This preliminary positioning prevents premature reactions with slurry chemicals while ensuring the CMP reaction occurs efficiently when needed.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method expedites the CMP process by generating radicals that effectively oxidize polymer materials on the wafer, improving surface planarization efficiency and stability of the slurry, reducing degradation issues and maintaining chemical stability.

Implementation Method 1

provide an oxidizer material on the polishing pad to generate a plurality of radicals to react with the article

Methodology Applied
Scientific EffectRadical generation: Chemical Bonding

Implementation Method 2

generate radicals that effectively oxidize polymer materials on the wafer

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 3

provide an oxidizer material and a catalyst material on the polishing pad to generate a plurality of radicals

Methodology Applied
Scientific EffectCatalysis: Catalysis

Data Source

PatentUS9962801B2Systems and methods for performing chemical mechanical planarization
Publication Date: 2018.05.08 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US9962801B2 patent drawing
  • US9962801B2 patent drawing
  • US9962801B2 patent drawing

AI summary

Systems and methods are provided for performing chemical-mechanical planarization. An example system includes: a polishing head, a polishing pad, a slurry distribution component, and a reactant distribution component. The polishing head is configured to perform chemical-mechanical planarization on an article. The polishing pad is configured to support the article. The slurry distribution component is configured to provide a slurry on the polishing pad. The reactant distribution component is configured to provide an oxidizer material on the polishing pad to generate a plurality of radicals to react with the article.