CMP Pad Composite Layer Pressure Equalization
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Solution Overview
Problem
Conventional CMP polishing pads with a three-layer structure face issues of delamination, air bubble entrapment, and surface protrusions, leading to non-uniformity and scratching defects due to the absence of a second soft pressure equalizing layer.
Innovation Solution
A CMP pad with a polymer layer having a three-dimensional network and a composite layer that integrates a first adhesive, providing pressure equalization across the pad surface with a hydrostatic modulus of 1 to 500 psi, eliminating the need for a separate pressure equalizing layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a three-layer structure with a separate adhesive layer is used, then the pad can be attached to the polishing tool, but the risk of delamination between layers increases
Solution Approach 1:
The adhesive layer is merged with the pressure equalizing layer into a single integrated composite layer. This composite layer simultaneously provides both adhesive functionality for attaching the pad to the tool and pressure equalization across the pad surface, eliminating the interface between separate adhesive and pressure equalizing layers that could delaminate.
Solution Approach 2:
The composite layer performs multiple functions: it acts as an adhesive to bond the pad to the polishing tool, serves as a pressure equalizing layer to distribute pressure uniformly across the pad surface, and provides structural support. This multi-functionality reduces the number of separate layers needed and eliminates delamination risks at layer interfaces.
2Strength
If a three-layer structure with a separate adhesive layer is used, then the pad can be attached to the polishing tool, but air bubbles or contaminants may be entrapped between layers
Solution Approach 1:
By combining the adhesive layer and pressure equalizing layer into a single integrated composite layer, the number of layer interfaces is reduced. This eliminates the interfaces where air bubbles and contaminants could become trapped during assembly, while still maintaining both adhesive bonding and pressure equalization functions.
3Strength
If a three-layer structure is used, then the pad can provide adhesive function, but the complexity of the pad structure increases
Solution Approach 1:
The adhesive layer and pressure equalizing layer are merged into a single composite layer, reducing the three-layer structure (polymer layer, adhesive layer, pressure equalizing layer) to a two-layer structure (polymer layer, composite layer). This simplification maintains all necessary functions while reducing structural complexity.
Solution Approach 2:
The composite layer is designed to perform multiple functions simultaneously: adhesive bonding to the tool, pressure equalization across the pad surface, and structural support. This multi-functionality eliminates the need for separate dedicated layers for each function, thereby reducing overall pad structure complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated adhesive and pressure equalization in the CMP pad enhance uniformity and prevent delamination, reducing the risk of scratching defects and ensuring consistent polishing performance.
Implementation Method 1
the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi
Implementation Method 2
a composite layer having the ability to equalize pressure across the pad surface including a first adhesive
Data Source
AI summary
The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.