Abrasion Apparatus TRIZ Cases

A sanding block features a curved edge with a radius of at least one-eighth inch to distribute pressure evenly across abrasive surfaces.

Convex polishing sheets with porous abrasive grains remove water stains from mirrors without scratching surfaces.

Dicarboxylic acid pore formers decompose endothermically to create controlled porosity in bonded abrasive tools.

Discontinuous coating islands on flexible backing prevent curling in humid environments while maintaining abrasive functionality.

A CMP pad with a dual curative system reduces scratches and chatter marks while maintaining removal rates.

A production tool positions shaped abrasive particles into cavities to transfer them onto a resin coated backing, forming a patterned layer with predetermined spacing and orientation.

A superabrasive grain setting method rectifies grid patterns on non-cylindrical surfaces to ensure uniform distribution.

A porous pressure sensitive adhesive article uses a hot melt adhesive layer to anchor the substrate, resolving weak attachment on large-area adherents.

A channel-free carrier ring presses against a polishing pad to direct slurry through curved-radial grooves toward the substrate.

Compacted synthetic fiber backing maintains flexibility while preventing binder penetration to improve tear resistance.

A polyurethane polishing pad uses a hygroscopic polymer blend to enhance surface stretchability.

Interlocking elongated deposits enhance heat dissipation and tear resistance, solving suboptimal particle distribution in flexible abrasive members.

Microcapsules enable precise pore size control to resolve manufacturing precision trade-offs.

A non-foamed polyurethane polishing pad uses a chemically crosslinked network to suppress surface scratches during semiconductor planarization.

A flexible resilient abrasive article with a textured gripping surface reduces deep scratches on curved surfaces while extending tool lifespan.

Segmented filament layers create an open lattice that reduces defect formation by enhancing fluid mechanics and maintaining consistent planarization.

An antiglare layer with a controlled glass transition point and specific protrusion diameter integrates directly onto the glass substrate.

Hollow microspheres in the polishing layer maintain porosity while limiting large pores, resolving debris retention and defect performance trade-offs.

Zirconium nitride binder in sintered cBN tools reduces frictional heat and arrests crack propagation during high speed machining.

Applying abrasive grains to fibers before web formation resolves homogeneity and reproducibility contradictions in non-woven abrasive production.

A squeegee smoothing device uses a V-shaped fabric sheet to remove surface irregularities from tool edges through frictional engagement.

Ice sublimation forms interconnected pores, preventing swarf accumulation and stabilizing shape during semiconductor wafer grinding.

A coated abrasive article incorporates a tribological performance enhancing composition within its supersize coat to improve material removal efficiency.

Axial mixing device intermixes poly and iso liquid components to eliminate machining steps, improving groove pattern quality.

A dry production method applies a hotmelt binder and lubricant to a flexible textile backing.

Thermal lamination bonds CMP polishing pad layers without adhesives, eliminating curing delays and chemical degradation risks.

Segmented unexpanded and pre-expanded porogens reduce density while maintaining viscosity for controlled pore distribution.

Laser cutting evacuates soot particles from aromatic binding agents, preventing contamination and reducing cleaning costs.

A double-layer abrasive material uses a radiation-curable lower binder to secure shaped cutting structures on the substrate.

A CMP pad embeds water soluble fibers in a continuous phase to create controlled porosity.

Patterned abrasive articles optimize particle distribution to enhance material removal rates while facilitating efficient swarf removal.

Porogens with low-boiling liquid fillers maintain high bulk density while creating surface porosity for precise planarization.

A CMP polishing pad uses a segmented foundation layer bonded to a soft surface layer for precise substrate planarization.

Segmented cavities in a placement tool situate shaped abrasive particles via vibration, resolving precision versus complexity trade-offs.

Etched hierarchical cavities on copper surfaces enable zero-contact-angle wetting without thermal barrier coatings.

An integrated composite layer in a CMP pad combines adhesive bonding with pressure equalization, eliminating delamination risks at separate interfaces.

Replacing polymer latex with polyester-modified urea-formaldehyde resin extends shelf life beyond thirty days while improving tensile properties.

Polythiol groups crosslink formaldehyde resins to improve binding strength and flexibility, reducing random scratch formation on work surfaces.

Limiting polyrotaxane monomer moisture below 5000 ppm prevents foam size fluctuations and physical property variations during polymerization.

A polishing pad light-transmitting region uses low aromatic density polyurethane to enable optical detection.

Shot peening processed steel with medium hardness media generates compressive residual stress while limiting surface scraping to 5 µm.

Gum arabic stabilizes grinding wheel green bodies during handling, reducing material loss and eliminating special furnace requirements.

An open cell foam abrasive article embeds resin and hard particles to modulate effective grit through applied pressure.

A fluid cutting apparatus impinges a high-pressure stream to slice through lithium-ion battery layers.

A single-layer non-woven abrasive article uses a fiber blend to enhance durability.

Elongated abrasive blobs align longitudinally within a nonwoven fiber web, resolving poor particle retention and random distribution in standard abrasive tools.

Resin impregnation reduces water absorption and improves tear resistance in composite abrasive backings.

Imidization aligns abrasive grains in a two-layer film, reducing scratches and uneven polishing on non-flat surfaces.