Polishing Pad Pore Distribution Control for Defect Reduction
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Solution Overview
Problem
Polishing pads with large proportions of pores 25 μm or greater lead to insufficient defect performance due to debris retention, affecting polishing accuracy and rate.
Innovation Solution
A polishing pad with a polishing layer containing hollow microspheres, where the average pore diameter is 10-14 μm, and the sum of pores 25 μm or greater is 5% or less, ensuring effective slurry retention and reduced debris accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If hollow microspheres are incorporated into the polishing layer to maintain porosity for slurry retention, then polishing rate is improved, but large pores (25 μm or greater) cause debris retention and reduce defect performance
Solution Approach 1:
The patent applies parameter changes by precisely controlling the pore size distribution through selection of hollow microspheres with specific diameter ranges (2-20 μm). By adjusting the pore diameter parameter to be predominantly below 25 μm while maintaining adequate porosity, the invention achieves both high polishing rate and excellent defect performance, resolving the contradiction between productivity and reliability
Solution Approach 2:
The patent applies local quality by creating different pore size distributions in different regions of the pore structure. The polishing layer contains both small pores (2-20 μm) for effective slurry retention and high polishing rate, while minimizing large pores (≥25 μm) that cause debris accumulation. This localized optimization of pore characteristics resolves the contradiction between maintaining porosity for productivity and preventing defects for reliability
2Quantity of substance
If hollow microspheres with larger diameter are used to maintain adequate porosity, then slurry retention is improved, but the proportion of large pores increases causing debris accumulation
Solution Approach 1:
The patent applies parameter changes by optimizing the hollow microsphere diameter parameter to a specific range (2-20 μm). This parameter selection ensures sufficient porosity for effective slurry retention while keeping individual pore sizes below the threshold (25 μm) that causes debris accumulation, thereby resolving the contradiction between quantity of substance and harmful factors
Solution Approach 2:
The patent uses hollow microspheres as standardized units to create the pore structure. By selecting microspheres with controlled diameter parameters and incorporating them uniformly into the polishing layer, the invention achieves consistent pore size distribution that maintains slurry retention while preventing debris accumulation, resolving the contradiction between effective substance retention and elimination of harmful factors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The polishing pad achieves a favorable polishing rate with excellent defect performance by minimizing debris retention and maintaining uniform pore distribution, enhancing polishing accuracy.
Implementation Method 1
the polishing layer includes hollow microspheres that form hollow bodies within the polishing layer
Implementation Method 2
the abrasive grains that are contained in the polishing slurry are held therein during polishing
Implementation Method 3
the abrasive grains that are contained in the polishing slurry are held therein during polishing
Implementation Method 4
the slurry 9 is a mixture (dispersion) of water and a variety of chemical components or fine hard abrasive grains and enhances the polishing effect due to a relative movement between the item to be polished 8 and the chemical components or the abrasive grains in the slurry that are made to flow
Data Source
AI summary
A polishing pad comprising a polishing layer that has a polishing surface for performing a polishing process on an item to be polished, wherein the polishing layer includes hollow microspheres that form hollow bodies within the polishing layer, a cross-section of the polishing layer has an average pore diameter of 10-14 μm, and in a histogram of pore diameters in a cross-section of the polishing layer where the bin width is 1 μm, the sum of pores that are 25 μm or greater is 5% or less with respect to the total number of pores in the cross-section, and the sum of the areas of the pores in each bin that is 25 μm or greater is 20% or less with respect to the total area of the pores in the cross-section.