CMP Pad with Dissolvable Fibers for Planarity

Solution Overview

Problem

In semiconductor wafer polishing, achieving high planarity without scratching defects is challenging due to the need for a hard and rigid pad surface, which can cause damage to soft metal surfaces used in advanced semiconductors.

Innovation Solution

A chemical mechanical planarization pad comprising a first component with a water soluble and water insoluble composition, where the water soluble material forms fibers and provides pores upon dissolution, embedded in a continuous phase of a second component, allowing for controlled hardness and reduced scratching risk.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a hard and rigid pad surface is used to achieve high planarity, then planarity is improved, but scratching defects increase on soft metal surfaces

Engineering Contradiction:

ImproveplanarityVSAvoidscratching defects

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The pad structure incorporates a hard rigid layer for overall planarity control and a soft compliant layer for local surface conformity, allowing different regions of the pad to have different hardness characteristics. This enables the pad to maintain rigidity where needed while being compliant where it contacts soft metal surfaces, thus achieving high planarity without scratching defects

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The pad is constructed as a composite structure with multiple layers having different mechanical properties - a hard rigid layer (such as porous ceramic or rigid foam) combined with a soft compliant layer (such as porous polymer or elastomer). This composite structure allows the pad to simultaneously provide the rigidity needed for planarity and the softness needed to prevent scratching of soft metal surfaces

Inventive Principle:

Principle #40Composite materials

2Object-affected harmful factors

If a soft and compliant pad surface is used to reduce scratching defects, then scratching defects are reduced, but planarity deteriorates

Engineering Contradiction:

Improvescratching defectsVSAvoidplanarity

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The pad structure incorporates a hard rigid layer for overall planarity control and a soft compliant layer for local surface conformity, allowing different regions of the pad to have different hardness characteristics. This enables the pad to maintain rigidity where needed while being compliant where it contacts soft metal surfaces, thus achieving high planarity without scratching defects

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The pad is constructed as a composite structure with multiple layers having different mechanical properties - a hard rigid layer (such as porous ceramic or rigid foam) combined with a soft compliant layer (such as porous polymer or elastomer). This composite structure allows the pad to simultaneously provide the rigidity needed for planarity and the softness needed to prevent scratching of soft metal surfaces

Inventive Principle:

Principle #40Composite materials

3Stability of the object's composition

If the pad surface is made harder to reduce local compliance, then local compliance is reduced, but scratching defects increase on soft metal surfaces

Engineering Contradiction:

Improvelocal complianceVSAvoidscratching defects

Core Design Contradiction:

Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The pad structure incorporates a hard rigid layer for overall planarity control and a soft compliant layer for local surface conformity, allowing different regions of the pad to have different hardness characteristics. This enables the pad to maintain rigidity where needed while being compliant where it contacts soft metal surfaces, thus achieving high planarity without scratching defects

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The pad is constructed as a composite structure with multiple layers having different mechanical properties - a hard rigid layer (such as porous ceramic or rigid foam) combined with a soft compliant layer (such as porous polymer or elastomer). This composite structure allows the pad to simultaneously provide the rigidity needed for planarity and the softness needed to prevent scratching of soft metal surfaces

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The pad achieves high planarity with reduced scratching defects by providing a controlled pore structure that retains polishing slurry and captures particles, enhancing the polishing process's effectiveness and yield.

Implementation Method 1

the water soluble composition may provide pores having a size in the range of 10 nanometers to 200 micrometers upon dissolution

Methodology Applied

Scientific EffectDissolution: Solvation

Data Source

PatentUS9796063B2Multi-layered chemical-mechanical planarization pad

Publication Date: 2017.10.24 FNS TECH CO LTD

AI summary

The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.